Industry News: ic coplanarity (Page 1 of 2)

What's happening at MIRTEC in 2008?

Industry News | 2008-03-25 23:53:54.0

Comment from Brian D�Amico, President

MIRTEC Corp

Lead Free Solders and Embedded Passives Headline Professional Development Schedule at 2003 IPC Annual Meeting

Industry News | 2003-07-08 09:48:46.0

taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.

Association Connecting Electronics Industries (IPC)

IPC Releases schedule of professional development courses

Industry News | 2003-08-27 10:58:00.0

Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting

Association Connecting Electronics Industries (IPC)

Viscom S3088 ultra – the flexible 3D-AOI with XM high-performance sensors

Industry News | 2014-04-01 15:20:47.0

Viscom launches the new Viscom S3088 ultra 3D-AOI system at NEPCON China in Shanghai (April 23 to April 25).

Viscom AG

Viscom Receives SMT China Vision Excellence Award for AOI

Industry News | 2015-04-26 17:28:35.0

Viscom AG is pleased to announce that it was awarded the 2015 SMT China Vision Excellence Award in the category of Inspection & Testing – AOI for its S3088ultra 3D AOI system. The award was presented to the company during an April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. The S3088ultra received the SMT China Vision Excellence Award for earning the top score in the AOI category.

Viscom AG

Vi TECHNOLOGY is hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrate solutions reducing defective PCBAs at SMT/HYBRID/PACKAGING 2010

Industry News | 2010-05-11 14:43:51.0

Saint-Egrève, France - Vi TECHNOLOGY is pleased to be hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrates its 5K Series at SMT/HYBRID/PACKAGING 2010. More VIT equipment will also be presented at our agent’s booth 7-219, SmartTech to demonstrate solutions reducing defective PCBAs.

Vi TECHNOLOGY

Vi TECHNOLOGY to Display Award-Winning SPI and AOI at SMT Hybrid Packaging

Industry News | 2015-04-07 15:51:51.0

Vi TECHNOLOGY will exhibit in Booth 7A-331 at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

Vi TECHNOLOGY

Vi TECHNOLOGY®'s component inspection solutions to reduce defective PCBAs @ Nepcon Shenzhen 2010

Industry News | 2010-08-09 13:23:20.0

Vi TECHNOLOGY will be represented with its Chinese Agents to exhibit AOI solutions to reduce defective PCBAs at Nepcon South China Shenzhen from August 31st to September 2nd.

Vi TECHNOLOGY

Vi TECHNOLOGY exhibits its full product range of AOI solutions at Nepcon China booth 4F10

Industry News | 2010-04-14 21:28:49.0

Saint-Egrève, France - Vi TECHNOLOGY exhibits its full product range of AOI solutions to reduce defective PCBAs at Nepcon China 2010 at Shanghai, from April 20th to 22nd booth 4F10.

Vi TECHNOLOGY

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