Industry News | 2022-08-08 07:10:23.0
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.
Industry News | 2019-08-21 16:21:55.0
The SMTA will organize the “Additive Electronics Conference: PCB Scale to IC Scale” on October 24, 2019 at the DoubleTree by Hilton San Jose in San Jose, California. The conference examines the manufacturing and design processes enabling line width and space from .003" to 5 microns as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter and more powerful electronic devices.
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2010-04-28 18:06:35.0
GAINESVILLE, GA ― Count On Toos Inc., a leading provider of precision components and SMT spare parts, introduces its new MYDATA Hydra replacement nozzles and consumables.
Industry News | 2010-03-27 19:26:29.0
BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2017-08-14 18:22:34.0
The SMTA Capital Chapter is pleased to announce that Shannan O’Shaughnessy of GVD Corporation, will present “Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Industry News | 2003-07-08 09:48:46.0
taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2003-08-27 10:58:00.0
Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting
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