Industry News | 2003-06-02 09:14:01.0
Specification-Driven Circuit Design Environment Now Slashes Validation Time Up to 10x
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Industry News | 2016-09-15 18:27:44.0
Motorized design takes guess-work out of repositioning applicators during printed circuit board assembly and electronics manufacturing.
Industry News | 2022-08-08 07:10:23.0
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2012-10-10 17:26:45.0
SMTA and CALCE are pleased to announce that the program is finalized for the Counterfeit Electronic Parts and Electronic Supply Chain Symposium West. The program is available on-line at www.smta.org/counterfeit and registration is open
Industry News | 2022-09-26 06:35:13.0
The electronics industry is calling on U.S. President Joe Biden to address urgent industrial base vulnerabilities and deliver on the promise of the CHIPS Act by prioritizing domestic development of printed circuit boards (PCBs) and integrated circuit (IC) substrates under Title III of the Defense Production Act.
Industry News | 2009-11-06 17:10:00.0
Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the the 6th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California.
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