Industry News | 2013-02-20 21:25:45.0
Acculogic Inc.announces that it has been awarded a 2013 NPI Award in the category of Test & Inspection – ICT for its Ultimate Accuracy Package for the Flying Scorpion.
Industry News | 2014-02-18 17:10:56.0
Acculogic Inc.announces that it will exhibit in Booth #2239 at the IPC APEX Expo, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2016-04-12 13:29:35.0
Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges. Indium10.2HF provides low cost-of-ownership to PCB assemblers through all-around balanced performance.
Industry News | 2017-09-12 20:15:18.0
SHENMAO Technology introduces New Generation Lead-free Solder Paste PF606-P140. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues and can easily fit into highly complicated PCB designs through excellent convergence performance.
Industry News | 2017-11-24 20:19:27.0
SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 to solve HoP issues and improve ICT Testability at SMTA Exhibition: November 29, 2017 booth # 22, 9 am to 3 pm Bestronics Facility, 2243 Lundy Ave, San Jose, CA 95131
Industry News | 2017-11-28 09:32:15.0
SHENMAO Technology introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.
Industry News | 2017-11-28 19:46:04.0
SHENMAO Technology, Inc. introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.
Industry News | 2019-01-21 10:13:48.0
Taipei, Taiwan] Test Research, Inc. (TRI) will reach a milestone this year, celebrating 30 years of business. Test Research, Inc. will be marking the anniversary throughout the year by showcasing Smart Factory Test and Inspection Solutions at seminars, exhibitions and trade shows. Founded on April 1989, Test Research, Inc. has grown
Industry News | 2019-01-27 20:25:48.0
Test Research will participate in the Smart Factory live Production Line at IPC APEX EXPO 2019 held at San Diego Convention Center. The production line will feature both the HERMES standard (IPC-9852) and IPC’s Connected Factory eXchange (CFX) IoT messaging standard (IPC-2591), working seamlessly together to deliver the value of SMT automation.
Industry News | 2020-07-14 16:26:56.0
Test Research, Inc. (TRI) will join NEPCON Asia held at the Shenzhen Exhibition & Convention Center to feature Innovative SMT Inspection solutions for the Smart Factory. Visit booth #1C65 to experience Smart Factory Inspection Solutions in action.
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