Industry News: image solder paste print defects (Page 9 of 62)

Exerra to Showcase the eP Series Printer in Orlando and Boston

Industry News | 2007-08-02 17:44:00.0

ePSeries Printers at SMTAI Booth#329 and Nepcon East# 723

Exerra, Inc.

High Temperature Soldering

Industry News | 2016-08-11 12:27:56.0

Do you need training material to conduct your own onsite training, a webinar or hands on High Temperature Soldering? We have it all covered at bobwillis.co.uk

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Saki Exhibits Smart Factory 3D AOI and SPI Systems at IPC APEX

Industry News | 2017-01-11 18:43:28.0

Saki Corporation, an innovator in the field of automated optical inspection equipment, will exhibit its 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems and their Smart Factory and Industry 4.0 capabilities at IPC APEX 2017, San Diego, CA, in booth 2909. Saki's inspection and measurement systems can be used to communicate with equipment in printed circuit board assembly lines to ensure that the PCBs are produced efficiently and adhere to the highest standards of quality and reliability.

SAKI America

QFN LGA Photos for your Training Courses

Industry News | 2016-12-29 06:52:15.0

One of the largest selection of QFN LGA images of solder joints and defects in the industry to use in your presentations to download online or on CD ROM

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HITACHI Solder Paste Printers, Koh Young SPI Systems Interface for ‘On-the-fly’ Print Process Optimization

Industry News | 2012-12-07 13:52:19.0

Hitachi high-speed, high performance solder paste printers and Koh Young Technology's 3D Solder Paste Inspection (SPI) systems can now "talk" to one another via Koh Young's award-winning Closed Loop Interface process control software. The process control software brings the SPI system and the printer together via a closed-loop communications link to not only identify defects in solder paste printing, but correct them at the printer.

Hitachi High Technologies America, Inc.

ProDEK Closed Loop Printing Technology Raises the Bar on Dynamic Process Control

Industry News | 2012-02-15 21:13:52.0

In a significant technology breakthrough set to upend former industry perceptions of closed loop printing processes, DEK announces the development and commercial launch of its revolutionary new closed loop innovation, ProDEK.

ASM Assembly Systems (DEK)

More BGA Defect Examples Available Royalty FREE

Industry News | 2017-01-05 04:27:37.0

BGA Inspection & Defect Photo Album (Can be downloaded) The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:

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Indium Corporation Features Indium8.9 Series Solder Pastes at APEX

Industry News | 2011-04-07 11:22:40.0

Indium8.9 Series solder pastes offer Pb-free and halogen-free solutions that eliminate graping and head-in-pillow defects.

Indium Corporation

Indium Corporation Features Indium8.9 Solder Paste at APEX

Industry News | 2012-02-16 18:04:11.0

Indium8.9 Solder Paste offers Pb-free and halogen-free solutions that eliminate graping and head-in-pillow defects.

Indium Corporation

Viscom Presents AOI Camera Module with 3D Technology at APEX

Industry News | 2014-02-20 14:47:22.0

Viscom announced today that it will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market in Booth #524 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.

Viscom AG


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