Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2018-10-18 09:29:21.0
Wave soldering welding interview direct contact with high temperature liquid in the production
Industry News | 2021-03-03 14:17:42.0
New CIT Relay & Switch IP67 Process Sealed VM3S Series Snap-Action Switch Protects Against Environmental Distress
Industry News | 2019-11-05 22:22:32.0
1. The definition of Sideplating Sideplating is actually the metalization of the board edge in PCB filed. Edge plating、Border plated、plated contour、side metal, these words can be used too to describe same function. 2. Sideplating Process Drilling - Milling plated Slots - Cleaning - Copper sink 3. Pictures to show the finished board’s sideplating
Industry News | 2011-04-06 13:13:52.0
Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.
Industry News | 2018-01-28 16:15:48.0
Nihon Superior will exhibit in Booth #1019 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in California. The company will introduce the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.
Industry News | 2018-04-03 08:04:48.0
Nihon Superior will exhibit in Stand 2L31 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.
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