Industry News: immersion silver pad adhesion (Page 2 of 3)

FCT Assembly's NL930PT Pin Probable Paste Wins a 2011 NPI Award

Industry News | 2011-04-20 20:31:30.0

FCT Assembly is pleased to announce that it has been awarded a 2011 NPI Award in the category of Soldering Materials for its NL930PT Pin Probable Solder Paste.

FCT ASSEMBLY, INC.

Cookson Electronics and Practical Components� Introduce Lead-Free Process Capability Program

Industry News | 2004-06-24 17:35:13.0

New Lead-Free validation kit and service smoothes transition to "green" electronic assembly.

Practical Components, Inc.

AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments

Industry News | 2014-10-14 11:36:35.0

AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments. AI Technology (AIT) is proud to present its improved Prima Protect™ coating line for moisture and salt fog protection.

AI Technology, Inc. (AIT)

Practical Components Announces PCB200-Thermal Cycle Availability

Industry News | 2010-07-16 16:08:56.0

Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces in-stock availability of the popular 15 mm PoP Thermal Cycling Board.

Practical Components, Inc.

Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications

Industry News | 2017-02-23 13:23:33.0

Henkel’s market leadership in solder materials development continues with the commercial launch of LOCTITE HF 2W, a tin-lead, water-washable solder paste designed for high-throughput, high-yield production. Halide- and halogen-free and REACH compliant, LOCTITE HF 2W addresses environmental responsibility while delivering outstanding performance for Pb-based soldering.

Henkel Electronic Materials

Tresky presents metallic sintering for power electronics at productronica 2023

Industry News | 2023-10-30 19:21:14.0

Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.

Tresky AG

Indium Corporation Technology Experts Presenting at IPC Midwest

Industry News | 2011-08-24 13:12:43.0

Indium Corporation experts will present technical findings at IPC Midwest Conference & Exhibition

Indium Corporation

AIM to Showcase NC259 Solder Paste at IPC Midwest

Industry News | 2012-07-25 10:17:38.0

AIM, will highlight its new NC259 Solder Paste

AIM Solder

AIM to Highlight New NC259 Solder Paste at SMTA International 2012

Industry News | 2012-09-13 14:02:26.0

AIMannounces that it will highlight its new NC259 Solder Paste in booth #401 at the upcoming SMTA International Conference and Expo,

AIM Solder

Henkel’s Multicore LF620 Lead-Free Solder Paste Sets the New Benchmark for the Lead-Free Era

Industry News | 2010-04-23 21:21:38.0

Never content to rest on the laurels of its proven lead-free success, Henkel has developed and launched Multicore LF620: a new lead-free solder paste that effectively delivers on a broad range of demanding requirements, essentially offering a lead-free paste that has it all.

Henkel Electronic Materials


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