Industry News | 2020-03-26 17:26:34.0
As a result of IPC's advocacy work, the U.S. EPA yesterday announced that it is exploring exemptions to the Toxic Substances Control Act (TSCA) "Fees Rule."
Industry News | 2024-03-11 15:00:03.0
Connect with our experts and see plasma and dispensing equipment for microelectronics manufacturing in booth 3645
Industry News | 2016-02-18 20:27:15.0
SolderLab today announced plans to exhibit in Booth #2913 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The company tests solder for alloy impurities based on industry standard IPC guidelines for J-STD-006C and J-STD-001F.
Industry News | 2012-08-21 20:28:27.0
SolderLab.comintroduces the SolderLab ROI Calculator – Cost of Rework Calculator.
Industry News | 2018-03-29 07:09:21.0
Anda Technologies USA removes all impurities and contaminants (including dust, grease and dirt, as well as static electricity), improving surface area adhesion.
Industry News | 2011-10-28 20:59:38.0
Seika Machinery announces that an independent lab has confirmed that its Solder Paste Recycling (SPR) machine is capable of producing pure solder ingots from solder paste.
Industry News | 2013-08-12 07:04:41.0
SolderLab.com has released its updated Web site.
Industry News | 2019-03-10 20:34:05.0
ZESTRON is pleased to announce that it will host “Should You Clean PCBs?” on Thursday March 21st, from 1:30 PM to 2:30 PM EDT. This is the first installment of the ZESTRON Academy 2019 Cleaning Webinar Series, and will be presented by our industry expert, Umut Tosun, M.S.Ch.E, Application Technology Manager.
Industry News | 2020-01-15 15:51:08.0
Nordson MARCH, a Nordson company introduces the PROGENY™ plasma treatment system with a chamber that is 2 meters deep with overall dimensions of 660mm W x 2260mm D x 660mm H for plasma treatment of catheters at their full extended length. Plasma cleans and activates the surface prior to applying a lubricious coating and provides adhesive bonding of the balloon to the catheter. It removes contamination, impurities, and organics at the nanometer level and improves surface wettability, hydrophilicity, and bonding capabilities to address issues such as poor wetting, poor coating uniformity, voids, and poor adhesion.
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