Industry News: ims tin whisker (Page 1 of 15)

Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

SMTnet

LEADING EXPERTS TAKE TIN WHISKERS FROM THEORY TO PRACTICE AT IPC CONFERENCE Are we understating the use of tin whisker risk mitigation methodologies?

Industry News | 2012-03-26 15:58:58.0

Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.

Association Connecting Electronics Industries (IPC)

Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium

Industry News | 2013-11-01 16:09:44.0

Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.

Association Connecting Electronics Industries (IPC)

IPC and CALCE Present 7th International Symposium on Tin Whiskers Event to Feature Experts from CALCE, Lockheed Martin and Other Leading Organizations

Industry News | 2013-10-01 18:21:25.0

IPC — Association Connecting Electronics Industries® and its educational partner, CALCE® (Center for Advanced Life Cycle Engineering) at the University of Maryland, will host the 7th International Symposium on Tin Whiskers, November 12–13, 2013, in Costa Mesa, Calif.

Association Connecting Electronics Industries (IPC)

SMTA Announces Co-Located June Events in Denmark

Industry News | 2009-02-24 13:53:56.0

Minneapolis, MN � The SMTA is pleased to announce its industry premier in Denmark with two co-located events focusing respectively on Tin Whiskers and Counterfeit Electronic Parts issues. The events will be held from June 23-26, 2009 at the Technical University of Denmark in Lyngby.

Surface Mount Technology Association (SMTA)

Call for Participation - Get More Bang for Your Buck with Two Presentation Opportunities in Denmark

Industry News | 2009-03-02 00:48:35.0

The SMTA and CALCE/University of Maryland are pleased to announce their industry premier in Denmark with two co-located events focusing respectively on Tin Whiskers and Counterfeit Electronic Parts issues. The events will be held June 23-26, 2009 at the Technical University of Denmark in Lyngby and are supported by the Centre for Electronic Corrosion (CELCORR) and ATV-SEMAPP at the Technical University of Denmark.

Surface Mount Technology Association (SMTA)

IPC and CALCE Seek Technical Papers for Tin Whiskers Symposium

Industry News | 2013-05-15 11:48:55.0

IPC – Association Connecting Electronics Industries® and the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland have issued a call for papers for the 7th International Symposium on Tin Whiskers.

Association Connecting Electronics Industries (IPC)

SMTA Capital Announces Speakers for their Vendor Day

Industry News | 2011-07-18 12:24:54.0

The Capital Chapter is pleased to announce the second technical presentation for their Expo and Tech Forum which will be held at the Johns Hopkins University, in Laurel MD on September 13, 2011.

Surface Mount Technology Association (SMTA)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

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