Industry News | 2006-05-04 17:10:18.0
Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products
Industry News | 2006-04-17 16:53:02.0
Event co-sponsored by iNEMI, the IEEE CPMT Society and ECTC
Industry News | 2023-07-19 09:52:10.0
The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due to tin-whisker mitigation concerns. This technical paper by Circuit Technology Center discusses the key process steps of this highly specialized process.
Industry News | 2010-03-30 14:09:38.0
OSAKA, JAPAN - Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman will present a paper titled "Effect of Soldering Method, Temperature, and Humidity on Whisker Growth in the Presence of Flux Residues" at the upcoming IPC/APEX conference and exhibition.
Industry News | 2022-01-24 18:01:46.0
Available component modification services utilizing Hentec/RPS Odyssey RHSD systems include BGA de-balling, gold mitigation, lead tinning and tin whisker mitigation.
Industry News | 2010-05-05 21:42:51.0
OSAKA, JAPAN — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Howell will present a paper titled “Effect of Soldering Method and Flux Type on Whisker Growth in SAC305” at the upcoming International Conference on Soldering and Reliability (ICSR), which is co-located with the Lead-Free Academy and SMTA Toronto Expo and Tech Forum.
Industry News | 2012-10-29 15:37:50.0
Murrietta Circuits now offers an entire menu of Re-Tinning capabilities
Industry News | 2013-11-05 22:51:20.0
Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, California.
Industry News | 2010-02-08 12:11:13.0
OSAKA, JAPAN — February 2010 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman will present a paper titled “The Relationship between Whisker Growth and Corrosion in Sn-3.0Ag-0.5Cu” at the upcoming TMS 2010 Annual Meeting & Exhibition, scheduled to take place February 14-18, 2010 at the Washington State Convention Center in Seattle.
Industry News | 2021-06-07 11:44:52.0
Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.
