Industry News: infrastructure (Page 1 of 50)

NEMI Premieres Latest Roadmap at APEX 2003

Industry News | 2003-02-06 08:28:24.0

Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2

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Introducing Monarch Technologies Group: EDA Sales Force for Hire

Industry News | 2003-04-21 10:09:08.0

New Sales, Marketing Channel for Emerging EDA Companies

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Merix Reports 3Q Net Loss of US$4.9M, Sales of $22.1M

Industry News | 2003-03-26 08:37:32.0

Oregon-based PCB maker Merix Corporation today reported results for its third quarter ended March 1, 2003.

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Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

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2002 NEMI Roadmap Points to Areas of Opportunity for Industry

Industry News | 2003-04-07 10:16:38.0

Portable Products and Optoelectronic Applications Still Hold Promise for Growth

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parvus Corp. Now Shipping its Biothenticator� PC/104 Biometric Fingerprint Sensor Module for Embedded System User Authentication

Industry News | 2003-03-27 08:15:33.0

Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics

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Brady Corporation Appoints David R. Hawke Executive Vice-president

Industry News | 2003-04-15 09:52:51.0

Announces a new region-based organizational structure

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NEMI Launches DPMO Project

Industry News | 2003-05-02 08:49:07.0

Group to Assemble Data by Package and Technology Type

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Merix Corporation Updates Guidance for the Third Quarter of Fiscal 2003

Industry News | 2003-01-31 09:39:08.0

Expected to be Below the Guidance Provided During the Company's Earnings Conference Call on December 18, 2002

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Nam Tai Electronics, Inc. Appoints Mr. Guy Bindels As Research and Development Director

Industry News | 2003-03-05 08:35:10.0

he will be responsible for formulating R&D strategies and spearheading the Company to keep abreast of the latest development in global manufacturing technology as well as strengthen its R&D division.

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