Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Industry News | 2018-04-09 19:48:04.0
SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2012-07-17 20:55:30.0
First Step in IPC’s Printed Electronics Initiative to Help Industry Grow
Industry News | 2003-07-08 09:48:46.0
taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2003-08-27 10:58:00.0
Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting
Industry News | 2019-05-16 01:24:13.0
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.
Industry News | 2013-03-27 15:21:59.0
PNC Inc. is proud to announce its latest UL qualification of polyimide base materials. PNC has partnered with Ventec USA using VT-901 laminate and VT-901PP prepreg. These high-temperature, high-reliability products expand PNC’s wide product offering and introduces the manufacturer into new industries at a new competitive level. The qualification includes 0.002” inner layer cores and a minimum overall board thickness stack up of 0.025”. The qualification also includes a minimum outer layer copper thickness of half ounce copper while inner layer maximum is two ounce copper.
Industry News | 2001-06-05 06:05:27.0
The X-ray inspection of multilayer PCBs increasingly requires an objective evaluation of e.g. inner layer misregistrations and annular ring widths at through-hole platings. After the recent release of the new software ml|module by phoenix|x-ray the necessary measurements of test patterns and vias can be performed easily and exactly. As all the application orientated software modules by phoenix|x-ray the ml|module can be integrated into auto-positioning (CNC) inspection programmes.
