Industry News: inner layer electromigration (Page 1 of 6)

European Ambitions for PCB Maker

Industry News | 2003-02-27 08:22:44.0

Circatex is to open its first satellite office in mainland Europe in France.

SMTnet

SMTA Europe Announces 1st Session of Technical Program for Harsh Environments Conference

Industry News | 2018-04-09 19:48:04.0

SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

IPC Releases Revision A to IPC-2222 Design Standard

Industry News | 2010-12-17 01:47:04.0

IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.

Association Connecting Electronics Industries (IPC)

IPC AND JPCA DEVELOP FIRST OPERATIONAL-LEVEL STANDARD FOR THE PRINTED ELECTRONICS INDUSTRY

Industry News | 2012-07-17 20:55:30.0

First Step in IPC’s Printed Electronics Initiative to Help Industry Grow

Association Connecting Electronics Industries (IPC)

Lead Free Solders and Embedded Passives Headline Professional Development Schedule at 2003 IPC Annual Meeting

Industry News | 2003-07-08 09:48:46.0

taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.

Association Connecting Electronics Industries (IPC)

IPC Releases schedule of professional development courses

Industry News | 2003-08-27 10:58:00.0

Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting

Association Connecting Electronics Industries (IPC)

Resin plug application and process

Industry News | 2019-05-16 01:24:13.0

With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.

Headpcb

Indium Corporation VP of Technology to Present SMTA Webtorial

Industry News | 2015-01-20 23:40:52.0

Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present two SMTA webtorials on Feb. 10 and 17. Dr. Lee's presentation, Electromigration-The Hurdle for Miniaturization and High Power Devices, discusses critical aspects regarding the electromigration of solder joints, including failure mechanisms, the effect of solder alloy composition, solder joint metallurgy and configuration, pad design and composition, current density, temperature, and current polarity.

Indium Corporation

Blind and Buried Via Boards

Industry News | 2018-10-18 11:14:24.0

Blind and Buried Via Boards

Flason Electronic Co.,limited

The Difference between Hot-dip Plastic Steel Pipe And Plastic-coated Steel Pipe

Industry News | 2023-11-29 08:26:15.0

The Difference between Hot-dip Plastic Steel Pipe And Plastic-coated Steel Pipe

Threewaysteel

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