Industry News: inner layer laminator (Page 1 of 12)

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

European Ambitions for PCB Maker

Industry News | 2003-02-27 08:22:44.0

Circatex is to open its first satellite office in mainland Europe in France.

SMTnet

IPC Releases Revision A to IPC-2222 Design Standard

Industry News | 2010-12-17 01:47:04.0

IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.

Association Connecting Electronics Industries (IPC)

SMTA Europe Announces 1st Session of Technical Program for Harsh Environments Conference

Industry News | 2018-04-09 19:48:04.0

SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

IPC TECHNOLOGY TRENDS STUDY REVEALS CHANGES IN STORE FOR PCB FABRICATORS AND SUPPLIERS

Industry News | 2012-04-27 19:20:10.0

PCB Technology Trends 2011, a new study published this week by IPC — Association Connecting Electronics Industries®, shows how the demands of miniaturization and high-speed technology are driving changes in printed circuit board (PCB) processes and materials.

Association Connecting Electronics Industries (IPC)

IPC AND JPCA DEVELOP FIRST OPERATIONAL-LEVEL STANDARD FOR THE PRINTED ELECTRONICS INDUSTRY

Industry News | 2012-07-17 20:55:30.0

First Step in IPC’s Printed Electronics Initiative to Help Industry Grow

Association Connecting Electronics Industries (IPC)

Congresswoman Sinema Tours Isola Group

Industry News | 2014-01-08 18:09:35.0

Congresswoman Kyrsten Sinema (AZ-9) visited Isola's manufacturing and R&D facilities in Chandler, Arizona on Friday, January 3 to learn about the issues that concern the developer and manufacturer of materials used to fabricate advanced printed circuit boards.

Association Connecting Electronics Industries (IPC)

New IPC Report Details How PCB Manufacturers Meet Today’s Technology Demands

Industry News | 2015-06-01 11:53:34.0

PCB Technology Trends 2014, a global biennial study published this month by IPC – Association Connecting Electronics Industries®, is now available. The survey-based study shows how PCB manufacturers are meeting today’s technology demands and looks at the changes expected by 2019 that will affect PCB fabricators and their suppliers of materials and equipment.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for Electronics Materials Forum Presentations sought on emerging technologies

Industry News | 2019-04-14 18:51:44.0

IPC -- Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.

Association Connecting Electronics Industries (IPC)

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