Industry News: insertion cost (Page 7 of 15)

Isola Introduces Ultra-Low Loss Materials for Applications Over 100 Gbps

Industry News | 2014-02-05 10:37:27.0

Isola Group has begun alpha testing of Tachyon, its new ultra-low loss product that is engineered to reduce insertion loss on high-peed digital designs. It is specifically being targeted for high-layer count backplanes for the growing 100 gigabit per second (Gbps) market that has channel data rates in excess of 25 Gbps.

Isola Group

Eliminating Latency in Next Gen WiFi 6E Devices

Industry News | 2020-08-03 11:52:42.0

Advanced High-Q RF components will play a critical role in larger goal of eliminating many of the latency issues of the past

Johanson technology

Eliminating Latency in Next Gen WiFi 6E Devices

Industry News | 2020-11-04 09:04:17.0

Advanced High-Q RF components will play a critical role in larger goal of eliminating many of the latency issues of the past

Johanson technology

Eliminating Latency in Next Gen WiFi 6E Devices

Industry News | 2020-11-04 09:13:07.0

Advanced High-Q RF components will play a critical role in larger goal of eliminating many of the latency issues of the past

Johanson technology

Universal Instruments Hosts 2009 Supplier Day

Industry News | 2009-11-25 14:18:10.0

Universal Instruments strengthened relationships with its supplier base by hosting an informal but informative Supplier Day at its Conklin, NY, USA headquarters. The singleday event provided an opportunity to update suppliers on Universal’s current position, as well as the company’s quality and reliability results and roadmap. It also served as an opportunity to review supplier expectations, performance, and initiatives.

Universal Instruments Corporation

Wafer-Scale Contactors Using Multitest Mercury Probes Successfully Deployed to Subcontractors in Asia

Industry News | 2010-09-22 14:38:52.0

Multitest announces that one of the world’s largest fab-less semiconductor manufacturers has evaluated Mercury-based wafer-scale contactors and found them superior to its previous traditional, POGO-style spring pin solution.

Multitest Elektronische Systeme GmbH

STI Electronics' BGA Reballer Kit Saves Money and Components

Industry News | 2010-09-26 16:12:24.0

STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its BGA Reballer Kit allows components to be reused.

STI Electronics

Seika Machinery Receives a 2012 NPI Award for Its Low-VOC Stencil Cleaner

Industry News | 2012-02-29 20:09:15.0

Seika Machinery has been awarded a 2012 NPI Award in the category of Screen/Stencil Printing Peripherals/Consumables for its Sawa Ecobrid SC-AH100 Fully Automatic Low-VOC Stencil Cleaner.

Seika Machinery, Inc.

Barry Industries Introduces Hermetically Sealable HTCC Air-Cavity Quad-Flat-No-Lead (QFN) Packages to 40GHz

Industry News | 2013-11-14 18:35:01.0

Barry Industries introduces their line of hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six (6) sizes from 3mm to 8mm with standard JEDEC MO-220 footprints.

Barry Industries, Inc.


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