Industry News | 2018-04-17 21:06:54.0
SMTA is excited to announce the technical program has been finalized and registration is now open for the International Conference for Electronics Enabling Technologies. The event will be held June 5-7, 2018 in Markham, Ontario, Canada.
Industry News | 2024-04-23 06:44:53.0
In the ever-evolving world of electronics manufacturing, SMT applications play a crucial role. As a leading company in this field, I.C.T has consistently delivered innovative solutions to its global clients. Recently, one of our experienced engineers, Andy, traveled to Mexico to provide technical suppor.
Industry News | 2016-08-31 18:41:55.0
IPC's Study of Quality Benchmarks for Electronics Assembly 2016 is now available. The annual study provides valuable benchmarking data to electronics assembly companies interested in comparing quality measurements to industry averages.
Industry News | 2016-10-09 20:43:23.0
The SMTA Capital Chapter is pleased to announce its final meeting of 2016 will be on November 10th, from 5:00 pm to 7:00 pm at Zentech, 6980 Tudsbury Road, Baltimore, Maryland 21244. The focus of this chapter meeting will be “AXI and MXI; How They Complement Each Other” presented by John Travis, Nordson Dage.
Industry News | 2018-04-24 08:50:23.0
The annual Quality Benchmark Study for Electronics Assembly, one of IPC’s most popular studies, is currently underway. The survey is online and available in both English and Mandarin Chinese. The deadline for participation has been extended to April 30.
Industry News | 2019-04-24 18:56:07.0
The 2019 Study of Quality Benchmarks for Electronics Assembly, one of IPC’s most popular annual studies, is currently underway. The survey is online and available in both English and Mandarin Chinese. The deadline for participation is May 17.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2012-12-03 19:52:39.0
Printed Board Assembly Cleaning and Contamination Testing Center marks its debut at IPC APEX EXPO®, February 19–21, 2013, at the San Diego Convention Center.
Industry News | 2022-10-12 08:07:17.0
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the circuit board assembly line. The basic principle of AOI is to judge whether the object to be tested meets the standard by comparing whether there is a large difference between the object to be tested and the standard image by using image technology. AOI emits a 4-color light source to the PCBA board, which is automatically scanned by an industrial camera for catastrophic failures, such as missing components or quality defects. Therefore, the quality of AOI depends on the image imaging ability, algorithm parsing ability and image discrimination technology. I.C.T AOI has done well in these aspects.
Industry News | 2021-02-15 14:41:46.0
– The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.
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