Industry News: instruments 10.power assembly (Page 1 of 78)

GPD Global Places MAX II Precision Dispenser at Universal Instruments' Advanced Process Lab

Industry News | 2019-12-17 14:33:13.0

December 17, 2019 – GPD Global has placed a MAX II precision dispenser at Universal's lab in New York (APL).

GPD Global

MIRTEC Announces Technical Collaboration with Universal Instruments’ Advanced Process Lab

Industry News | 2019-10-21 16:37:01.0

MIRTEC is pleased to announce that it has installed one of its Award-Winning MV-6 OMNI 3D AOI Systems at Universal Instruments’ Advanced Process Lab (APL) in Conklin, New York. Universal’s APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability.

MIRTEC Corp

Card-to-cable Connector Meets QS9002 Standard

Industry News | 2003-02-20 08:04:10.0

The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.

SMTnet

Newport Corporation has New Board Members

Industry News | 2003-04-21 09:53:12.0

Michael T. O'Neill and Peter J. Simone

SMTnet

NEMI Launches DPMO Project

Industry News | 2003-05-02 08:49:07.0

Group to Assemble Data by Package and Technology Type

SMTnet

Jabil Circuit Deploys Tradec's Cost Management Solution

Industry News | 2003-07-03 08:45:09.0

Leading Electronic Manufacturing Service Provider Leverages Tradec Solution to Manage Commodity Cost and Accelerate the Quotation Process

SMTnet

CirTran Further Expands Domestic Sales Capacity to Over 40 Representatives

Industry News | 2003-03-12 08:14:19.0

Today announced the addition of two leading electronics sales representative firms designed to increase CirTran's domestic sales volume.

SMTnet

Titan General Holdings, Inc Reconstitutes Board of Directors

Industry News | 2003-05-09 08:35:07.0

Bringing the board experience more in line with its business objectives

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

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instruments 10.power assembly searches for Companies, Equipment, Machines, Suppliers & Information

Golden State Assembly
Golden State Assembly

Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)

Manufacturer

18220 Butterfield Blvd
Morgan Hill, CA USA

Phone: 5102268155