Industry News | 2012-04-10 15:42:07.0
SEHO Systems GmbH will showcase the new AOI function for its best-selling selective soldering system - the SEHO PowerSelective
Industry News | 2012-04-27 08:43:28.0
SEHO Systems GmbH, a worldwide leading manufacturer of automated soldering systems and customer-specific solutions, announces that it has been awarded a 2012 EM Asia Innovation Award in the category of Soldering Systems – Auxiliary for the new AOI function for its best-selling selective soldering system – the SEHO PowerSelective
Industry News | 2013-03-18 10:28:43.0
SEHO Systems GmbH,will highlight several machines in hall 9, stand 209 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2014-01-31 00:23:23.0
Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.
Industry News | 2017-11-15 20:34:16.0
SEHO Systems GmbH is pleased to announce that it was awarded a 2017 Global Technology Award in the category of Soldering – Selective for its Integrated Additional Processes in Selective Soldering Systems. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place during productronica in Munich, Germany. The SEHO PowerSelective and SEHO SelectLine selective soldering systems can be equipped with an automated selective brush system and an AOI system for immediate automatic cleaning and inspection of solder joints directly after the soldering process. All processes are integrated in ONE machine.
Industry News | 2014-02-27 11:48:51.0
Several Indium Corporation technology experts will present at IPC APEX March 25-27 in Las Vegas, Nevada.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2021-08-12 20:58:16.0
When we use the Refrigeration Compressors, there could be frosting. It's a failure that we can solve. So this article will take you to look at the reasons for frosting and the corresponding solutions.
Industry News | 2012-03-29 18:25:04.0
ViTrox Technologies will showcase its leading AOI and AXI solutions in booth 1G88 at the upcoming NEPCON China 2012
Industry News | 2015-08-11 13:31:16.0
“The ViTrox V810 system has proven to be quite capable in its intended mission, helping us produce defect-free product for IPC610, Class III customers in the Defense, Aerospace, Industrial Computing and Medical market sectors. The machine is very reliable and we really appreciate the outstanding support from the ViTrox team for training, upgrades and technical information.” Dane Wentworth, Senior Vice President, MPI
