Industry News | 2008-09-12 03:52:21.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Laura Turbini (Session Chair) of Research in Motion, Doug Pauls of Rockwell Collins, Joe Russeau of Precision Analytical Laboratory, Steven Perng of Cisco Systems, and Jack Fischer of Interconnect Technology Analysis will present in Session 2 on Cleanliness Assessment. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Industry News | 2024-02-12 14:07:03.0
The SMTA is excited to introduce a new event for the electronics manufacturing industry which takes place on March 26, 2024 in Peoria, Arizona, USA. The Ultra High Density Interconnect Symposium will be held at the Peoria Sports Complex.
Industry News | 2024-03-18 11:59:32.0
The SMTA is excited to announce a Workforce Development Breakfast Panel, "Building Tomorrow's Expertise," taking place on March 26, 2024 in Peoria, Arizona, USA. The panel will be held at the Peoria Sports Complex, in conjunction with the SMTA Ultra High Density Interconnect Symposium.
Industry News | 2013-03-26 17:09:31.0
The recently released 2013 IPC International Technology Roadmap for Electronic Interconnections marks a shift that is occurring throughout the electronics industry: more cooperation and information sharing.
Industry News | 2015-06-18 17:23:06.0
IPC Association Connecting Electronics Industries® has released IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. This ever evolving standard provides common language of terms and definitions for the electronics industry.
Industry News | 2008-07-24 17:38:17.0
Scotts Valley, CA � 15 July, 2008 - Vertical Circuits, Inc.(VCI), a leading supplier of advanced 3D die-level interconnect solutions, today announced its recognition of Asymtek, a Nordson company (Nasdaq: NDSN) and leader in dispensing, coating and jetting technologies, as a �Partner in Innovation.� Asymtek's Axiom� automated dispensing system plays a key role in enabling the high-volume manufacturing capability for VCI's 3D vertical interconnect process.
Industry News | 2003-08-27 10:43:02.0
This 41-page document is the complete source for printed circuit board and electronics assembly standards and publications for design, materials, manufacturing, assembly, quality and test.
Industry News | 2010-10-30 01:11:30.0
With only five months left in its development, the 2011 IPC International Technology Roadmap for Electronic Interconnections is paving its way to being the most controversial roadmap to date.
Industry News | 2012-03-22 19:12:37.0
The long-awaited 2011 IPC International Technology Roadmap for Electronic Interconnections was released last month at IPC APEX EXPO® 2012. Published biennially, the IPC Roadmap serves as an authoritative guide to interconnect technological trends, providing a vision of imminent, innovative technology.
Industry News | 2024-04-15 11:05:25.0
IPC presented its highest corporate honors to two IPC member companies, Summit Interconnect and Robert Bosch GmbH during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2024. The Peter Sarmanian Corporate Recognition Award was presented to Summit Interconnect and the Stan Plzak Corporate Recognition Award was presented to Robert Bosch GmbH.
