Industry News: interface board (Page 11 of 86)

PRESS RELEASE: IPC APEX is 2 Weeks Away!

Industry News | 2018-02-08 09:25:01.0

IPC APEX 2018 is 2 Weeks Away! Visit YINCAE at Booth 2732

YINCAE Advanced Materials, LLC.

Multitest’s Chris Cuda to Discuss Pros and Cons of ATE Boards at BiTS 2011

Industry News | 2011-02-07 15:33:41.0

Multitest announces that Chris Cuda, US Product Manager, will present a paper titled "Benefits & Risks of High Aspect Ratio Vias in ATE Boards" at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, Arizona.

Multitest Elektronische Systeme GmbH

AI Technology, Inc. (AIT) Releases Cool-Gumpad™ (Thermal Interface Pad) CGP7156

Industry News | 2014-06-05 12:21:18.0

AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.

AI Technology, Inc. (AIT)

Reduce Risk and Increase Productivity with Robotic Soldering

Industry News | 2019-01-30 20:37:50.0

Metcal today announced the global launch of the first Robotic Soldering System with patented Connection Validation (CV) technology and a touchscreen graphical user interface to drastically mitigate the risk of solder joint defects and add productivity to the manufacturers’ soldering process.

Metcal

1000th Gemini™ Kelvin Contactor Shipped – A Three Year Success Story

Industry News | 2010-04-20 10:02:26.0

St.Paul, Minnesota - Multitest’s ECT Interface Products group announces the shipment of its 1000th Gemini™ Kelvin contactor. The customer base for this product consists of satisfied customers around the world. All Gemini™ Kelvin customers have been repeat customers. In just three years, these contactors have become extremely successful because they provide a first-rate solution that effortlessly makes reliable, true Kelvin contact for high-volume final test of both singulated packages and wafer-scale devices.

Multitest Elektronische Systeme GmbH

KDPOF Complements Renesas' New Vehicle Computer VC4

Industry News | 2022-05-03 11:30:37.0

1000BASE-RHC Optical Physical Layer Adds Robust and EMC-safe Network Interface to Communication Gateway ECU

KD

Nordson DAGE Announces New Materials Test Capability at Productronica 2011

Industry News | 2011-11-27 00:48:58.0

Nordson DAGE announced its new Materials testing capability on the 4000Plus at the Productronica exhibition.

Nordson DAGE

Multitest Engineers to Hold Tutorial during BiTS 2011

Industry News | 2011-02-09 14:05:35.0

Multitest announces that Ryan Satrom, RF Engineer, and Jason Mroczkowski, RF Engineering and Product Manager, will hold a tutorial titled "Signal and Power Integrity in the Test Interface" at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ.

Multitest Elektronische Systeme GmbH

Fontasa Memory Systems Signs Distribution Agreement with New Yorker Electronics

Industry News | 2021-01-06 09:50:55.0

Agreement Establishes Highly Certified Distributor New Yorker Electronics as Preferred Supplier of Advanced Solid State Memory Systems

New Yorker Electronics


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Thermal Transfer Materials.