Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
Industry News | 2018-02-02 18:44:38.0
The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee and attendees based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation.
Industry News | 2008-01-23 10:59:08.0
San Jose, CA - �The International Wafer-Level Packaging Conference (IWLPC) has issued a call for papers for its fifth annual program on Oct. 13-16 at the Wyndham Hotel in San Jose.
Industry News | 2011-08-15 12:43:52.0
The SMTA and Chip Scale Review magazine are pleased to announce eight in-depth tutorials will be offered at IWLPC 2011. Tutorials are application-oriented and structured to combine field experience with scientific research to solve everyday problems.
Industry News | 2012-11-20 17:32:47.0
During the 2012 Annual Meeting at SMTA International, the SMTA announced that Xian Qin, a graduate student at Georgia Institute of Technology, has been selected as the recipient of the 2012 Charles Hutchins Educational Grant.
Industry News | 2013-12-04 09:24:54.0
SMTA announced that the Early Bird Registration Deadline for the 19th Annual Pan Pacific Microelectronics Symposium is January 8, 2014.
Industry News | 2014-05-13 14:03:06.0
The SMTA has issued a call for papers for the 2014 Pan Pacific Microelectronics Symposium, which will be held 3 - 5 February 2015 on Kauai, Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly.
Industry News | 2010-05-30 23:23:13.0
Minneapolis, MN - The Surface Mount Technology Association (SMTA) announces the Call for Papers for the 2011 Pan Pacific Microelectronics Symposium, which will be held January 18-20, 2011 on the Big Island of Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 16, 2010.
Industry News | 2010-08-17 13:31:00.0
The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe!
