Industry News: ionic activity (Page 1 of 3)

Electrochemical Reliability Is the Focus of Session 4 at SMTA Europe's Harsh Environments

Industry News | 2018-04-15 20:01:15.0

SMTA Europe announces Session 4 Technical Program on Electrochemical Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

Practical Support on Cleaning and Contamination Monitoring Processes Printed Board Assembly Cleaning and Contamination Testing Center to Debut at IPC APEX EXPO 2013

Industry News | 2012-12-03 19:52:39.0

Printed Board Assembly Cleaning and Contamination Testing Center marks its debut at IPC APEX EXPO®, February 19–21, 2013, at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Dr. Mike Bixenman to Present at the SMTA Medical Electronics Symposium

Industry News | 2018-04-25 20:16:44.0

KYZEN today announced that Mike Bixenman, DBA, will present at the SMTA Medical Electronics Symposium, scheduled to take place May 16-17, 2018 at the University of Texas at Dallas. In addition to the presentation, Jack Reinke, KYZEN cleaning expert, will be at table #8 during the Expo. Reinke will be available to meet with attendees to answer cleaning process questions.

KYZEN Corporation

MicroCare Presents its Latest Advancements in Cleaning at SMT Hybrid Packaging

Industry News | 2018-04-18 18:12:03.0

MicroCare Europe bvba will showcase its newest electronics cleaning products at the SMT Hybrid Packaging Show in Nuremberg, Germany. The expo runs from 5-7 June 2018. These new circuit cleaners will help companies boost quality, enhance throughput and lower PCB production costs. They also will help clients meet ever-more stringent European regulations

MicroCare Corporation

MicroCare Presents its Latest Advancements in Cleaning at SMT Hybrid Packaging

Industry News | 2018-05-01 19:37:14.0

MicroCare Europe bvba will showcase its newest electronics cleaning products at the SMT Hybrid Packaging Show in Nuremberg, Germany. The expo runs from 5-7 June 2018. These new circuit cleaners will help companies boost quality, enhance throughput and lower PCB production costs. They also will help clients meet ever-more stringent European regulations

MicroCare Corporation

MicroCare Addresses PCB Cleaning with New Products at SMTAi

Industry News | 2018-09-23 09:54:24.0

The industry’s leading manufacturer of critical cleaning, coating and lubrication products, MicroCare Corp. has extended its portfolio even further with the launch of new and progressive products which will be showcased at this year’s SMTA International in Chicago, Illinois, USA from 14 – 18th October, which includes a new series of flux remover pens.

MicroCare Corporation

Aqueous Technologies Presents Next Installation in E-Learning Video Series: Zero-Ion G3 Ionic Contamination Tester

Industry News | 2009-04-23 20:43:27.0

RANCHO CUCAMONGA, CA � April 2009 � Aqueous Technologies Corp. announces the publication of its newest video presentation, �An Introduction to the Zero-Ion G3 Ionic Contamination Tester.�

Aqueous Technologies Corporation

Kyzen to Exhibit at Elektronik EP

Industry News | 2008-01-16 13:21:22.0

NASHVILLE � January 16, 2008 � Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will exhibit at the Elektronik EP exhibition in distributor Elnitec�s stand C15:51. The exhibition is scheduled to take place January 28-30, 2008 in Stockholm, Sweden.

KYZEN Corporation

KYZEN’s Dr. Mike to Present No-Clean Flux Residue Study Findings at SMTAI

Industry News | 2016-09-07 18:44:03.0

KYZEN announces that Dr. Mike Bixenman will present the recent paper entitled, “Reactivity of No-Clean Flux Residues Trapped Under Bottom Terminated Components” during SMTA International. The paper is co-authored by Bruno Tolla, Ph.D., Jennifer Allen and Kyle Loomis from Kester and will be presented during the “Flux, Solder, Adhesives Track” on Tuesday, September 27, 2016 at 3 p.m.

KYZEN Corporation

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