Industry News | 2017-01-24 18:45:22.0
The SMTA Capital Chapter is pleased to announce its first meeting of 2017 on February 23rd, scheduled from 5:00 pm to 8:00 pm at The Test Connection, 11400 Cronridge Drive, Suite H, Owings Mills, MD, 21117. The focus of this chapter meeting will be “Flying Probe in Modern Day” presented by Joe Folsom and Tim Dykes, The Test Connection, featuring a demo and tour of the facility.
Industry News | 2011-04-01 13:21:14.0
IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Conference on Reliability: Assembly Process for a Reliable Product, November 1–2, 2011 in Irvine, Calif. Focused on reliability issues arising at the assembly level, the conference will highlight new developments in materials, process and test.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2016-04-12 15:29:42.0
The SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 29 - December 1, 2016 at the Crowne Plaza Midtown in Atlanta, GA.
Industry News | 2017-05-30 19:40:07.0
The SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 28 - November 30, 2017 at the Archie K. Davis Conference Center in Research Triangle Park, NC.
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Industry News | 2012-06-29 17:09:10.0
Electronic product and manufacturing trends continue to challenge both users and providers of test and inspection technologies at all levels of the supply chain.
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Industry News | 2015-03-03 21:14:08.0
The SMTA and CALCE are pleased to announce the new LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 17 - 19, 2015 at the Crowne Plaza Midtown in Atlanta, GA.
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, CA USA
Phone: 5102268155
