Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2017-06-21 11:27:14.0
USB Type-C and Power Delivery Protocol Analyzer is available in several configurations to suit specific needs and budget
Industry News | 2013-10-09 09:50:45.0
The Balver Zinn Group today announced that it will sponsor the IPC hand soldering competition at Productronica, scheduled to take place November 12-15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2022-05-23 15:30:28.0
New Tri-color Series delivers High Brightness for Smart Devices, Wearables, Decorative Lighting, Auto Lighting and More
Industry News | 2017-10-05 19:42:55.0
YAMAHA announces the launch of its YSi-V 12M Type HS2 high-end hybrid Automated Optical Inspection (AOI) system. The YSi-V 12M Type HS2 offers faster inspection speed, higher precision, and enhanced capacity and performance for specular components.
Industry News | 2021-10-28 21:21:44.0
A quote of a central air conditioner consists of the following prices: equipment (outdoor unit & indoor unit) + materials + installation cost + maintenance cost.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2016-04-19 05:13:13.0
The Balver Zinn group announced that they will sponsoring the IPC Hand Soldering Competition at SMT Hybrid Packaging in Nuremberg-Germany, scheduled to take place April 26-28, 2016. Balver Zinn will be contributing BRILLIANT B2012 solder wire which is halide-free, rosin based and designed for manual and robotic soldering.
Industry News | 2017-05-09 04:41:07.0
The Balver Zinn group announces that they will sponsoring the IPC Hand Soldering Competition at SMT Hybrid Packaging in Nuremberg-Germany, scheduled to take place May 16-18, 2017. Balver Zinn will be contributing BRILLIANT B2012 solder wire which is halide-free, rosin based and designed for manual and robotic soldering.
Industry News | 2017-11-03 09:46:42.0
The Balver Zinn Group announced that they will be sponsoring the IPC Hand Soldering Competition (IPC-HSC) scheduled to take place November 14-16, 2017 at Productronica - New Munich Trade Fair Centre in Munich, Germany. Balver Zinn will be providing BRILLIANT B2012 SAC305 (SN97C) solder wire which is halide-free, rosin based and designed for manual and robotic soldering.
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
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