Industry News | 2003-06-18 07:56:46.0
The IPC-9850 test materials kit includes all the materials needed for manufacturers to test flexible placement machines and chip shooters to the specifications of the IPC-9850 standard.
Industry News | 2012-01-07 21:49:07.0
As EMS companies have ramped up speeds to meet the high demand for electronics, equipment manufacturers have responded by developing machines that quickly shift from handling one package style to another with fewer sacrifices in precision. To help industry determine the best equipment setup to meet needs for speed, capability and accuracy, IPC has released revision A to IPC-9850, Surface Mount Placement Characterization, making it far simpler to quantify the performance of placement equipment.
Industry News | 2012-02-28 14:00:06.0
IPC presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO® at the San Diego Convention Center.
Industry News | 2013-02-08 17:43:21.0
Manncorp introduces the MC-LEDV3, a new high-speed pick and place machine built to assemble LED tube lights, flexible LED strips and LED bulb boards. The MC-LEDV3 features three pick-and-place heads mounted on a high-precision, ball-screw-driven gantry. Simultaneous pickup, on-the-fly (vision based) component alignment, and feeder placement optimization combine to achieve placement rates of up to 10,000 LEDs per hour, per IPC-9850.
Industry News | 2011-01-10 13:51:26.0
Juki Corporation announces that its KE-3020 features the company’s latest leading-edge technology for improved flexibility and production quality. The system supports both electronic and mechanical tape feeders and can handle boards up to 22” x 24". With its multi-nozzle (six nozzles) laser head, the KE-3020 can achieve a rated IPC9850 speed of 17,100 cph and is capable of a component placement range from 01005 (0402 metric) to 74mm2.
Industry News | 2019-10-24 16:14:40.0
Essemtec announces that it was awarded a 2019 Mexico Technology Award in the category of Component Placement – Multi-function for its FOX2. The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.
Industry News | 2003-04-08 18:29:26.0
New for 2003
Industry News | 2018-09-17 21:21:59.0
Essemtec will demonstrate the FOX2 with Micro Valve dispensing solder paste for 0201 and 01005 and placing them in same machine for NPI and prototyping.
Industry News | 2017-07-27 13:42:24.0
Essemtec today announced plans to exhibit at the SMTA Capital Show, scheduled to take place on Aug. 24, 2017. The company will demonstrate the FOX2 that combines jetting of solder paste or glue and placement in a single machine.
IPC is the trade association for the printed wiring board and electronics assembly industries.
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