Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2019-09-03 11:13:26.0
IPC E-Textiles Europe 2019, a two-day technical education conference for innovators, technologists and brands/OEMs, will provide a platform for education and collaboration among a diverse group of professionals interested in producing e-textiles technologies and products. Developed by the e-textiles industry for the e-textiles industry, IPC E-Textiles Europe 2019 will also provide technical insights of interest to myriad market segments, including fashion design, health monitoring, medical, automotive, aerospace and military. The conference will take place in Munich, Germany, November 12-13, 2019.
Industry News | 2022-01-14 17:06:40.0
Expanded technical conference award categories include NextGen and Student Research
Industry News | 2014-07-08 13:23:01.0
Since implementing the Schleuniger machines, Tesla Motors has seen reduced processing time and has gained assurance that the wires are being processed precisely each time.
Industry News | 2010-03-15 13:23:37.0
Rehm Thermal Systems has introduced new cooling zone designs for their Vision Series convection reflow ovens. The new technology is particularly effective for the homogenous cooling of large thermal mass PCBs.
Industry News | 2021-07-22 14:58:14.0
BSU, Inc. recently announced that the company, a growing EMS provider in Austin, Texas, has achieved IPC-620 Certification to support its growing cable assembly business (RF, shielded, unshielded, twisted pair, coax, flex, and others).
Industry News | 2015-01-21 20:38:21.0
Akrometrix will exhibit in Booth #2935 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will demonstrate the Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during a microelectronics production reflow profile.
Industry News | 2014-03-19 13:27:35.0
Koh Young America and Koh Young Technology (Seoul, Korea) will demonstrate exciting new breakthroughs in PCB inspection at IPC/APEX 2014 in Las Vegas, Nevada this coming week.
Industry News | 2016-02-17 16:31:00.0
Akrometrix LLC will exhibit in Booth #1623 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.
Industry News | 2013-09-10 13:21:08.0
Koh Young will exhibit new SPI and AOI measurement technology at the upcoming SMTAI conference and exhibition in Fort Worth, Texas, in Booth #136
IPC is the trade association for the printed wiring board and electronics assembly industries.
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