Industry News: ipc-2222 trace spacing (Page 5 of 6)

New Low Cost Breakout Boards Accelerate PLD Design and Hardware Evaluation

Industry News | 2011-03-28 11:42:40.0

Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of three new low cost I/O Breakout Boards: the MachXO™ 2280 Breakout Board, the ispMACH® 4256ZE Breakout Board and the Power Manager II POWR1014A Breakout Board.

Lattice Semiconductor

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

Electronics Manufacturers to Gather in Shenzhen With Numerous Exhibits Targeted at the Industry Hotspots

Industry News | 2012-08-15 12:25:12.0

NEPCON South China 2012 will take place between August 28 and August 30, 2012 at the Shenzhen Convention & Exhibition Center

Reed Exhibitions

Electronics Manufacturers to Gather in Shenzhen With Numerous Exhibits Targeted at the Industry Hotspots

Industry News | 2012-08-20 07:56:16.0

NEPCON South China 2012will be present with their new products, providing a comprehensive showing of the latest electronics production equipment products and technologies.

Reed Exhibitions

Mentor Graphics RocketIO Design Kit for HyperLynx Simplifies Simulation of Xilinx Multi-Gigabit Designs

Industry News | 2003-07-08 09:38:05.0

The RocketIO Design Kit for HyperLynx ensures system design companies reach their time-to-market goals

Mentor Graphics

A multifunctional printed circuit board, integrating sensor and evaluation electronics, has passed initial customer production release tests

Industry News | 2009-04-23 21:31:21.0

W�rth Elektronik's cantilever sensors revolutionise applications such as ERP and identification systems

Würth Elektronik GmbH & Co. KG

Resin plug application and process

Industry News | 2019-05-16 01:24:13.0

With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.

Headpcb

Catching up with PNC

Industry News | 2015-11-16 10:47:48.0

Catching up with PNC with Dan Beaulieu, D.B. Management Group

PNC Inc.

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

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