Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2003-05-12 08:52:56.0
September 21-25, Donald Stephens Convention Center, Rosemont, IL
Industry News | 2003-06-09 08:40:10.0
The Opening Session and Annual Meeting during SMTA International will be held on Tuesday, September 23.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2013-02-20 18:54:10.0
IPC — Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center.
Industry News | 2018-03-14 18:46:31.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO 2018 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Industry News | 2011-12-07 23:13:30.0
FCT Assembly announces holiday savings at its new online store, located at www.fctassembly.net.
Industry News | 2011-09-21 13:59:11.0
FCT Assembly announces that it will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #206 at the upcoming SMTA International Conference & Exhibition.
Industry News | 2012-01-24 16:23:30.0
FCT Assembly will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #612 at the upcoming IPC APEX Expo.
Industry News | 2009-05-18 17:19:51.0
GREELEY, CO - FCT Assembly debuts WS159 water-soluble solder paste, featuring FCT's latest technology in print and reflow of paste in the water soluble category.
