Industry News | 2012-06-13 09:00:19.0
BTU International, Inc., will highlight new High Efficiency (HE) flux management and dual-lane, dual-speed capabilities of its PYRAMAX™ solder reflow system, as well as the latest WINCON™5.0 control software in booth #F22 at the NEPCON West China 2012.
Industry News | 2009-09-17 15:06:04.0
OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 624 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA.
Industry News | 2020-12-18 11:42:34.0
Mil-Spec, 4-Terminal Capacitors from Barker Microfarad feature Low Inductance and Wide Temperature, Voltage and Capacitance Ranges
Industry News | 2009-04-15 16:24:57.0
WESTMORELAND, N.H. � April 2009 �Polyonics introduces four new materials to help win over new and existing projects.
Industry News | 2013-01-16 08:45:06.0
Nihon Superior Co. Ltdwill introduce a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, lead-free die attach, void minimization, environmental protection, and process yields.
Industry News | 2008-11-12 20:09:45.0
November 10, 2008 - Haverhill, MA � CircuitMedic's Flextac Wire Dots replace glues and adhesives with super-sticky tape specially designed and cut to permanently secure circuit board jumper wires. This unique wire tacking product consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. Flextac Wire Dots conform to the shape of the wire and the board surface providing a high strength bond to quickly and neatly secure jumper wires.
Industry News | 2012-01-21 16:28:10.0
Nihon Superior will introduce the newest addition to its SN100C lead-free solder series in Booth #3044 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.
Industry News | 2019-04-01 19:37:06.0
Nordson MARCH announces the introduction of its FlexTRAK®-SHS automated plasma treatment system. The plasma system includes the 9.6-liter (585 in³) large-volume F3-S process chamber that can be configured for larger strips or can treat more strips per cycle, yielding higher throughput and increased productivity for semiconductor and electronics packaging.
Industry News | 2010-03-22 13:59:02.0
GREELEY, CO — FCT Assembly introduces its NL932 no-clean, lead-free, halide-free solder paste. The paste features excellent solderability, enabling the process to handle the most difficult wetting requirements.
Industry News | 2015-11-16 10:47:48.0
Catching up with PNC with Dan Beaulieu, D.B. Management Group
