Industry News: ipc-a-610 lga voids (Page 1 of 3)

Now Available: Amendments for J-STD-001F and IPC-A-610F

Industry News | 2016-01-17 19:26:58.0

In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.

Association Connecting Electronics Industries (IPC)

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated ‘F’ Revisions Cover More Advanced Technologies

Industry News | 2014-09-06 17:51:35.0

IPC — Association Connecting Electronics Industries® has released the F revisions of two of the industry’s most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies.

Association Connecting Electronics Industries (IPC)

SMTA China Presents Awards at SMTA China East 2011

Industry News | 2011-05-16 16:53:28.0

SMTA China announces that it presented eight overall awards, nine best paper/presentation awards and two best exhibit awards at the SMTA China East 2011 Conference Award Presentation Ceremony, held on Thursday, May 12, 2011 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Fifth Anniversary Gala dinner.

Surface Mount Technology Association (SMTA)

SMTA Intermountain Chapter to Hold Annual Technical Symposium

Industry News | 2013-09-10 12:18:26.0

The Surface Mount Technology Association (SMTA)'s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.

Surface Mount Technology Association (SMTA)

Indium Corporation Technology Expert to Present at Assembly, Cleaning, and Reliability Workshop

Industry News | 2014-05-22 11:36:25.0

Indium Corporation's Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.

Indium Corporation

Indium Corporation’s Insight on Solder Preforms to Reduce Voiding in Bottom Termination Components

Industry News | 2015-10-30 15:33:26.0

Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.

Indium Corporation

Cobar Solder Products to Sponsor the Second Annual IPC Midwest Soldering Competition

Industry News | 2012-07-26 09:54:31.0

The Balver Zinn Group announces that Cobar Solder Products Inc. will sponsor and participate in the second annual IPC Midwest Soldering competition held in conjunction with the IPC Midwest Exhibition & Conference

Balver Zinn

AMTECH Introduces a New Solder Paste, VS-213, Also Known as the Voidstopper

Industry News | 2014-06-17 21:50:29.0

SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.

AMTECH

Indium Corporation Technology Experts to Present at IMAPS New England

Industry News | 2014-04-18 21:23:36.0

Indium Corporation technology experts will serve as session chair and give a poster presentation at IMAPS New England May 6 in Boxborough, Mass.

Indium Corporation

Nordson DAGE to Introduce X-Plane™ to the U.S. Market for the First Time at the 2012 IPC APEX Expo

Industry News | 2012-01-17 16:27:31.0

Nordson DAGE will introduce X-Plane™ to the U.S. market for the first time in Booth #3208 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

Nordson DAGE

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