Industry News | 2011-02-04 02:11:47.0
Before the action on the IPC APEX EXPO™ show floor begins, senior-level executives of PCB and EMS companies will meet to discuss industry challenges at the PCB Executive Management Meeting and EMS Management Council Meeting on April 11, 2011. Focused on providing executives with key information to successfully navigate today’s business environment, these full-day meetings are rare opportunities for executives to hear from industry experts and to network with peers, suppliers and customers.
Industry News | 2016-05-05 20:10:24.0
IPC – Association Connecting Electronics Industries® and the Information Technology Industry Council (ITI) will host a conference series on “Critical and Emerging Environmental Product Requirements” this June.
Industry News | 2014-10-22 13:26:01.0
Today, Congressman Rob Woodall (R-GA-7) met with executives and employees of IPC member-companies, Hunter Technology in Lawrenceville, Ga. and Viscom in Duluth, Ga., as part of a nationwide effort to discuss with policymakers legislative and regulatory issues that affect the electronics manufacturing industry. IPC and its member companies have hosted more than a dozen Members of Congress in 2014 at a variety of locations across the country.
Industry News | 2015-01-16 17:33:28.0
Today, Congressman Mike Honda (D-CA-17) met with executives and employees of IPC-member company, Hunter Technology Corp., in Milpitas, Calif. Hunter Technology provides a full range of electronic design, manufacturing and test services. This visit is part of a nationwide effort to discuss with policymakers legislative and regulatory issues that affect the electronics manufacturing industry.
Industry News | 2013-07-22 17:01:59.0
Isola Group S.a.r.l. announced today its new low loss, low skew, high-speed material, GigaSync™. This product has been engineered to eliminate skew issues in high-speed designs that use differential pairs to create a balanced transmission system able to carry differential (equal and opposite) signals across a printed circuit board.
Industry News | 2013-12-18 15:18:53.0
Isola Group had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products. The cost benefits of manufacturing in Asia have enabled a price reduction of I-Speed for printed circuit board (PCB) fabricators located in the Asia-Pacific region.
Industry News | 2013-07-17 13:56:57.0
Isola Group announced today the site expansion of its Suzhou, China manufacturing facility. The substantial upgrade includes two additional hot oil presses, semi-automatic layup lines and an additional cleanroom.
Industry News | 2012-08-03 02:36:21.0
MILPITAS, Calif. — August 3 2012 — Bliss Industries Inc., a leader of material handling carts and racks for PCB assembly, has officially revealed its patent pending ESD Tray Divider breakthrough for PC board handling.
Industry News | 2016-02-25 14:29:00.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
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