Industry News: j lead (Page 1 of 55)

Teradyne Expands Presence in China and Opens Shanghai Facility

Industry News | 2003-03-12 09:10:10.0

As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.

SMTnet

Newport Corporation has New Board Members

Industry News | 2003-04-21 09:53:12.0

Michael T. O'Neill and Peter J. Simone

SMTnet

Northrop Grumman Enters Military Printed Circuit Board Market

Industry News | 2003-04-15 08:39:15.0

Granted supplier qualification by the United States Department of Defense's Defense Supply Center Columbus (DSCC)

SMTnet

Photronics Names John Chin Vice President - Asia

Industry News | 2003-07-09 09:00:46.0

He will have responsibility for all aspects of Photronics� manufacturing and sales activities in China, Singapore and Taiwan.

SMTnet

Sales and Result Improved: VOGT electronic on the Right Course

Industry News | 2003-05-29 08:30:31.0

Losses halved in the first half year � New organization of electronics group next on the agenda

SMTnet

Baja Bid Online Auction – June 3-5, 2014 (Featuring Items From OneChip Photonics)

Industry News | 2014-05-22 15:42:29.0

Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.

Baja Bid

IPC J-STD-001E Released: Industry Requirements for Soldered Electrical and Electronic Assemblies Updated

Industry News | 2010-04-10 02:07:54.0

IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.

Association Connecting Electronics Industries (IPC)

Update of IPC J-STD-609 Provides Greater Delineation of Lead-free Solders for Marking and Labeling

Industry News | 2010-04-10 02:05:54.0

IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.

Association Connecting Electronics Industries (IPC)

Now Available: Amendments for J-STD-001F and IPC-A-610F

Industry News | 2016-01-17 19:26:58.0

In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.

Association Connecting Electronics Industries (IPC)

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