Industry News | 2016-06-15 20:20:37.0
The first ever Rework Experience Competition was held at this year’s SMT Hybrid Packaging international exhibition and conference. This competition tested competitor’s skills in reworking a finished printed circuit board. There were seven total competitors and all seven successfully completed the challenge. Ljupce Talevski, from Aluwave AB took first place. In second place was Ekatarina Stahlmann from Grundig Business Syst. Coming in third place was Conny Hielscher from Grundig Business Syst.
Industry News | 2011-01-20 13:45:14.0
IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2018-12-08 03:25:54.0
Basic Soldering Guide – How to Solder Electronic Components
Industry News | 2018-12-08 03:20:37.0
Top Silicon Wafer Manufacturing Companies in the World
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2010-03-27 20:30:39.0
Ovation on Booth 1173 at APEX is focused on innovative tools that optimize customers’ print processes to deliver great returns on investment. Taking centre stage is Grid-Lok Gold, the company’s latest fully automatic tooling solution for board and substrate support being launched at APEX 2010. Accompanying is Magna Print, a universal squeegee blade holder and paste deflector system – complete with compelling special APEX offer.
Industry News | 2021-04-13 17:37:07.0
Gold plating dissolves rapidly during soldering and can result in gold embrittlement. This tech paper examines how to re-condition electronic components prior to soldering.
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