Industry News: j-std-001 damage to solder pad ling (Page 1 of 2)

IPC Workshops Highlight Updates to Key Industry Standards: IPC-A-610, J-STD-001, and IPC-A-600 and IPC-6012

Industry News | 2010-04-19 12:56:32.0

BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.

Association Connecting Electronics Industries (IPC)

Electronics Industry Volunteers Honored for Contributions to Industry and IPC

Industry News | 2011-04-20 21:26:17.0

IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service awards and a Presidents Award at IPC APEX EXPO™, held April 10–14, in Las Vegas.

Association Connecting Electronics Industries (IPC)

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Industry News | 2018-10-18 08:21:10.0

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Flason Electronic Co.,limited

How to Prevent Short Circuits to Ground in QFN Components?

Industry News | 2018-10-18 08:29:16.0

How to Prevent Short Circuits to Ground in QFN Components?

Flason Electronic Co.,limited

BEST Expands Rework Services with Automated Non-contact Scavenging

Industry News | 2013-01-24 07:34:04.0

VJ Electronix, Inc announces the installation of a new 400ST Automated Scavenger System into BEST’s Rolling Meadows, IL facility.

VJ Electronix

Practical Components to Exhibit Its Latest Technologies at iMAPS 2018

Industry News | 2018-10-02 17:16:16.0

Practical Components announces that it will display its latest technology in booth 827 at the upcoming iMAPS 2018 – Pasadena 51st International Symposium on Microelectronics exhibition and conference, scheduled to take place October 9-11, 2018 at the Pasadena Convention Center in California.

Practical Components, Inc.

Practical Components® to Exhibit Its Newest Wafer and Evaluation Vehicles Technologies at IWLPC

Industry News | 2018-10-15 18:31:07.0

Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.

Practical Components, Inc.

Practical Components® to Exhibit Its Newest Wafer and Evaluation Vehicles Technologies at IWLPC

Industry News | 2018-10-18 19:55:33.0

Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.

Practical Components, Inc.

Visit Practical Components at APEX to Learn about the Latest Innovations in Components, Test PCBs and Solder Training Kits

Industry News | 2019-01-05 16:48:58.0

Practical Components is a premier supplier to the global electronics industry specializing in mechanical IC samples or “dummy” components, evaluation PCBs and solder training kits. Practical will feature its latest technology in booth 1609 at the upcoming IPC APEX EXPO 2019 exhibition and convention, scheduled to take place January 29-31, 2019 at the San Diego Conference Center in California.

Practical Components, Inc.

Intel and VJ Technologies to Present Pad Site Dress Methods at SMTAI 2010

Industry News | 2010-09-27 23:15:26.0

VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

VJ Electronix

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