Industry News | 2016-06-15 19:49:11.0
Computrol today announced that it has purchased and installed an Assembléon iFlex T2 and two iFlex H1s from Kulicke & Soffa. The lane iFlex T2 is a multifunctional or line-balancing solution with a large component range. The iFlex H1 end-of-line solution offers odd-form and gripper capabilities.
Industry News | 2015-08-11 09:37:25.0
Saline Lectronics now offers wire bonding in-house as an added-value service. With the installation of the Kulicke & Soffa 4500 Manual Wedge Bonder, Saline Lectronics is now one of the only electronic contract manufacturers in the Midwest to support wire bonding services.
Industry News | 2003-04-08 18:29:26.0
New for 2003
Industry News | 2018-03-13 18:47:01.0
TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.
Industry News | 2007-11-27 12:28:45.0
FINEPLACER� FEMTO, introduced in beginning of 2007, is now optimized for one of the most sophisticated bonding application. Due to the high process flexibility the FEMTO can handle both laser bar processes AuSn and Indium.
Industry News | 2018-08-29 19:32:05.0
omputrol today announced that it has invested in another Kulicke & Soffa/Assembléon AX-501 Pick-and-Place system. Additionally, the company added another iFlex H1 end-of-line solution from Kulicke & Soffa/Assembléon.
Industry News | 2017-01-03 15:23:03.0
DKL Metals is pleased to announce the company’s 30-year anniversary. As the UK’s foremost producer of lead-free solders and tin-lead alloys for the European industry, DKL produces ultra-pure solder alloys for the electronics assembly and HASL industry.
Industry News | 2010-08-27 23:24:15.0
Data I/O Corporation (NASDAQ: DAIO), the leading provider of manual and automated device programming solutions, today announced that TMPL Electronics PVT. LTD will showcase its FlashPak III in booth 1752at the upcoming Productronica India, scheduled to take place September 6-9, 2010 at the Bangalore International Exhibition Center (BIEC) in Bangalore, India.
