Industry News: ke2010 20mm laser control (Page 1 of 2)

JUKI'S KE-2020 FLEXIBLE ASSEMBLER IS DESIGNED TO PRODUCE MORE JOBS IN LESS TIME

Industry News | 2001-06-15 15:37:28.0

FlexHybrid technology enables high-mix, high-throughput production

Juki Automation Systems

Juki to Exhibit FX-1R at Nepcon East 2007

Industry News | 2007-10-23 16:09:16.0

MORRISVILLE, NC - October 23, 2007 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will highlight the FX-1R High-speed Chip Shooter in booth 615 at the upcoming Assembly New England/Nepcon East exhibition and conference scheduled to take place October 30-31, 2007 at the Boston Convention & Exhibit Center.

Juki Automation Systems

Juki to Feature FX-1R High-Speed Chip Shooter at APEX 2009

Industry News | 2009-03-24 12:59:22.0

MORRISVILLE, NC - March 2009 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will highlight the FX-1R High-speed Chip Shooter in booth 759 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

Juki Automation Systems

Juki to Feature FX-1R at Nepcon East 2008

Industry News | 2008-04-22 20:41:32.0

MORRISVILLE, NC - April 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will highlight the FX-1R High-speed Chip Shooter in booth 817 at the upcoming Nepcon East exhibition and conference, scheduled to take place April 30-May 1, 2008 at the Boston Convention & Exhibition Center in Boston.

Juki Automation Systems

Juki to Highlight FX-1RL at IPC Midwest 2008

Industry News | 2008-09-16 12:20:13.0

MORRISVILLE, NC - September 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will exhibit the FX-1RL High-speed Chip Shooter in booth 809 at the upcoming IPC Midwest exhibition and conference, scheduled to take place September 24-25, 2008 in Schaumburg, IL.

Juki Automation Systems

JUKI to Answer Industry Need for Latest Technology Chipshooters, Flexible Mounters, Intelligent Feeders and Software at Productronica 2009

Industry News | 2009-12-07 18:55:54.0

Solothurn, Switzerland - October2009 - JUKI, a world-leading provider of automated assembly products and systems, announces that it will highlight its latest line-up of brand new and tried and tested Chipshooters, Flexible Mounters, Intelligent feeders and Software in Hall A3, Stand 143 of the Productronica exhibition. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.

Juki Automation Systems

Juki Corp. to Showcase CX-1 Advanced Placement System at APEX 2008

Industry News | 2008-03-20 17:16:35.0

MORRISVILLE, NC - March 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will exhibit the CX-1 Advanced Placement System in booth 2025 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

Juki Automation Systems

Juki Corp.'s CX-1 Advanced Placement System Wins Attendee's Choice Award at SEMICON West 2008

Industry News | 2008-07-23 21:29:52.0

MORRISVILLE, NC - July 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that its CX-1 Advanced Placement System has won the Attendee's Choice Award in the Best Solution to a Problem category among �Final Manufacturing� products. The award presentation took place July 16, 2008 on the show floor of the SEMICON West 2008 exhibition. Juki highlighted CX-1 in booth 7360 on Level 1 of the West Hall.

Juki Automation Systems

Submicron semi-automatic flip eutectic placement machine flip eutectic placement machine

Industry News | 2019-12-16 22:42:05.0

T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.

Beijing Technology Company

ESSEMTEC to Highlight a Range of Leading-Edge Technologies at SMT Hybrid Packaging 2013

Industry News | 2013-04-10 11:48:47.0

Essemtec, announces that it will exhibit numerous flexible Swiss-made solutions in Booth 7, Hall 211 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

ESSEMTEC AG

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