Industry News | 2019-06-26 19:57:27.0
IPC is applauding the U.S. House of Representatives for approving a measure that would promote research and development into the performance of lead-free electronics in high-reliability sectors such as aerospace, defense, automotive, and medical equipment.
Industry News | 2019-11-21 14:17:10.0
IPC’s Hand Soldering World Championship was held November 14 at productronica 2019 in Munich, Germany. This global event included 17 competitors representing companies in France, Hungary, Indonesia, Poland, Germany, Thailand, Malaysia, Korea, Vietnam, United Kingdom, Japan, India, China and the Philippines.
Industry News | 2021-09-30 16:37:16.0
Registration is now open for the 2022 WHMA 29th Annual Wire Harness Conference. Geared to wire harness manufacturers, their suppliers and customers, the event will take place in person, February 15-17, 2022 in Tucson, Arizona at the Westin La Paloma Resort and Spa.
Industry News | 2007-10-05 21:28:08.0
MINNEAPOLIS, MN - During the Annual Meeting at SMTA International (Wednesday, October 10th, at the Gaylord palms Resort in Orlando, FL.), the association honored members who have shown exceptional service to the association and the industry.
Industry News | 2018-10-18 11:13:35.0
PCB Outline Layer And Keep-out Polygon Clearance
Industry News | 2019-07-16 19:49:23.0
PVA will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, Aug. 8, 2019 at the Holiday Inn Cleveland Strongsville. Company representatives will highlight the SJ100 non-contact jet valve for selectively applying conformal coatings onto substrates with close keep-out tolerances.
Industry News | 2018-07-17 13:56:31.0
Tiny RF chip antennas are no longer relegated to PCB “keep out” area, allowing product designers to further miniaturize wireless biosensors and medical wearables
Industry News | 2018-07-17 14:02:04.0
Connected, “smart” wearables such as rings, bracelets, clothing and shoes are benefitting from tiny RF chip antennas that take up less PCB space and allow for more miniaturized devices
Industry News | 2017-03-06 12:24:15.0
Last month at the IPC APEX Expo event in San Diego, California, Henkel’s TECNOMELT AS 8998 hot melt masking material was presented with a Circuits Assembly NPI award in recognition of its ability to meet several criteria, including: creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, speed/throughput improvements, performance, user-friendliness, and expected maintainability and reparability. The award capped off what has been a successful first year for TECHNOMELT AS 8998, which was commercialized in early 2016 and has already lowered cost and improved operational efficiency at several global electronics manufacturers.
Industry News | 2016-09-21 15:44:21.0
From booth #936 at the upcoming SMTA International event in Rosemont, Illinois, Henkel Adhesive Electronics’ display will underscore why the company leads the market in comprehensive assembly materials technologies. With multi-award-winning LOCTITE GC solder materials, a broad range of leading-edge thermal management technologies, and new applications for TECHNOMELT products, the Henkel booth is the go-to destination for advanced electronics assembly materials.
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