Industry News | 2009-07-24 14:12:49.0
Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.
Industry News | 2009-08-07 19:24:15.0
Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.
Industry News | 2003-06-13 12:19:32.0
SMTA International Special Symposiums and Emerging Technologies Summit
Industry News | 2009-12-17 18:14:12.0
Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the Best of Conference Paper from the 6th Annual International Wafer-Level Packaging Conference and Exhibition, which was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California. After review by members of the 2009 IWLPC Technical Committee, In-Soo Kang (NEPES Corporation) has been selected as the Best of Conference award winner for his technical paper on "Development of Wafer Level Package of Normal and High Pin Count Devices for Mobile Applications."
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