Industry News: kic thermal profiler (Page 1 of 77)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Advances in Heated Dispense Process

Industry News | 2016-06-27 14:59:09.0

GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.

GPD Global

International Rectifier Introduces Bi-Directional Dual MOSFET in the FlipFET Package

Industry News | 2003-01-29 13:23:31.0

A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Technical Presentations at the Upcoming SMTA Capital Chapter Expo on August 23rd

Industry News | 2018-08-16 19:58:50.0

The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.

Surface Mount Technology Association (SMTA)

SMTA Capital Chapter’s Expo and Tech Forum to be Held on August 22nd

Industry News | 2019-07-09 19:58:49.0

The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road,Laurel, MD 20723, on Thursday, August 22nd.

Surface Mount Technology Association (SMTA)

BGA Component Rework

Industry News | 2001-08-02 18:32:09.0

BGA Rework Profiling

Precision PCB Services, Inc

XDry Introduces the XDry M.O.L.E.

Industry News | 2009-10-16 16:10:36.0

User-Configurable Process Audit Tool

XDry

IPC-CFX-2591 Qualified Product Listing Achieves Major Milestone

Industry News | 2021-04-06 12:34:23.0

IPC announces a major milestone for the IPC-CFX-2591 Qualified Product Listing (QPL), with 10 pieces of equipment from five different companies now on the QPL. Models listed on theIPC-CFX-2591 QPL have all passed third-party virtual audit to verify the equipment is broadcasting and receiving mandatory IPC-CFX message sets outlined in IPC-2591, Version 1.3, as approved by the 2-17 Connected Factory Initiative Subcommittee.

Association Connecting Electronics Industries (IPC)

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