Industry News: kla (Page 1 of 1)

IWLPC Best Papers Announced

Industry News | 2015-01-15 19:44:09.0

SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Surface Mount Technology Association (SMTA)

Wafer-Level Packaging Symposium Program Announced

Industry News | 2023-12-18 13:31:02.0

The SMTA is excited to announce the technical program for the Wafer-Level Packaging Symposium. The symposium will be held February 13-15, 2024 at The Hyatt Regency San Francisco Airport in San Francisco, California.

Surface Mount Technology Association (SMTA)

Multitest Names New President

Industry News | 2011-07-13 15:34:21.0

Multitest announces that Reinhart Richter has been promoted to President of the Multitest Group effective immediately.

Multitest Elektronische Systeme GmbH

Everett Charles Technologies Appoints Technical Marketing Director for Asia

Industry News | 2011-07-22 23:05:33.0

Everett Charles Technologies - Electrical Test (ET) has appointed Vincent Yu to Technical Marketing Director for Asia.

Everett Charles Technologies

Electro Scientific Industries Announces Management Changes

Industry News | 2003-04-16 08:12:30.0

Revises Restatement of First and Second Quarters and Results of Third Quarters of 2003

Electro Scientific Industries

CBA Group Appoints Debbora Ahlgren Vice President of Marketing

Industry News | 2011-03-09 21:57:49.0

The CBA Group, comprised of Universal Instruments Corporation and Hover-Davis, announces the appointment of Debbora (Deb) Ahlgren as Vice President of Marketing, reporting to Jean-Luc Pelissier, CEO and President of CBA, Universal Instruments and Hover-Davis.

Universal Instruments Corporation

CyberOptics to Demonstrate the New SQ3000 3D AOI with Multi-Reflection Suppression Technology Inside

Industry News | 2015-02-04 17:36:37.0

CyberOptics® Corporation announces that it will demonstrate the new SQ3000™ 3D Automated Optical Inspection (AOI) system in Booth #3332 at the IPC APEX EXPO, Feb. 24-26, 2015 at the San Diego Convention Center in California.

CyberOptics Corporation

SEMICON West 2021 Hybrid- Explore New Semiconductor Supply Chain

Industry News | 2021-12-01 02:11:09.0

Semicon West 2021 To Gather Visionaries To Explore New Semiconductor Supply Chain Strategies And Opportunities

einnosys

  1  

kla searches for Companies, Equipment, Machines, Suppliers & Information

Selective Soldering Nozzles

High Throughput Reflow Oven
Pillarhouse USA for Selective Soldering Needs

Training online, at your facility, or at one of our worldwide training centers"
Voidless Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications
High Throughput Reflow Oven

High Resolution Fast Speed Industrial Cameras.