Industry News | 2008-03-25 22:45:17.0
Comment from Gary Stoffer, Vice President � Global Sales
Industry News | 2011-06-07 18:26:32.0
Nordson MARCH announces the global availability of the MaxVIA™ plasma treatment system that streamlines the printed circuit board (PCB) manufacturing process by quickly and uniformly treating a variety of panel sizes and types.
Industry News | 2021-10-28 11:50:17.0
Indium Corporation's Product Development Specialist Miloš Lazić will share his industry knowledge on thermal interface materials (TIMs) at PCB Carolina on Nov. 10 in Raleigh, N.C., USA.
Industry News | 2013-12-10 12:14:34.0
Indium Corporation introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium's unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.
Industry News | 2014-05-15 10:32:50.0
Indium Corporation and Kyzen hosted a technical seminar on April 29 in Hsinchu, Taiwan. The seminar featured presentations by Sze Pei Lim, Indium Corporation’s technical manager for Southeast Asia, and Jason Chan, Kyzen’s technical applications manager. Each presented on a variety of topics, including low temperature alloys, cleaning semiconductor devices, and new technologies.
Industry News | 2014-05-29 14:42:57.0
Indium Corporation's Assistant Technical Manager Liyakathali Koorithodi will present at the SMTA India chapter's quarterly meeting on May 30 at Sathyam Group Resorts in Sriperumbudur, India.
Industry News | 2016-02-10 16:01:59.0
Equipment Services LLC announced that it has chosen Lean Stream LLC to represent its ESE high-precision SMT screen printers in Northern California and Nevada.
Industry News | 2016-03-03 10:33:15.0
Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China. Lim's presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process.
Industry News | 2016-04-12 13:29:35.0
Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges. Indium10.2HF provides low cost-of-ownership to PCB assemblers through all-around balanced performance.
Industry News | 2020-11-03 13:15:31.0
Indium Corporation and RENEX Group have formed a strategic partnership for the service of their PCB and engineered solder materials in Poland.
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