Industry News | 2024-01-15 14:07:45.0
The following is a statement by Richard Cappetto, Senior Director, North American Government Relations at IPC, the electronics manufacturing association, on the release of the National Defense Industrial Strategy (NDIS) yesterday by the U.S. Department of Defense. A fuller statement is in this IPC Blog.
Industry News | 2024-05-06 12:02:15.0
This week, IPC delivered a letter to Congress signed by 49 industry executives, representing most of the U.S. electronics supply chain, urging Congress to sustain current investments in the defense electronics industrial base or risk exacerbating defense risks and vulnerabilities.
Industry News | 2021-09-30 16:20:50.0
IPC is calling on the U.S. electronics manufacturing community to contact members of Congress about a bill that would boost investment in federal research and development (R&D) in 10 high-tech fields. We hope your media organization will help us publicize this effort.
Industry News | 2006-09-20 11:32:52.0
September 20, 2006
Industry News | 2015-10-11 18:04:26.0
Indium Corporation announces the release of its newest technology publication, SMT with Phil Zarrow, authored by SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting.
Industry News | 2011-03-21 13:24:25.0
Indium Corporation's Global Product Manager, Semiconductor and Advanced Assembly Materials, Dr. Andy Mackie , will be presenting at the Surface Mount Technology Association (SMTA) Intermountain Expo and Technical Forum, March 22, 2011 at Boise State University, Boise ID.
Industry News | 2008-08-14 13:03:22.0
Indium Corporation's industry leading electronics assembly bloggers are hosting a Meet the Bloggers session on Wednesday, August 20, 2008 at Indium Corporation's SMTAI exhibit booth #517 at 11:00am EST.
Industry News | 2008-10-01 23:36:35.0
Two of Indium Corporation's technology experts will be participating in the International Wafer-Level Packaging Conference (IWLPC), October 13-16, 2008 in San Jose, CA: Semiconductor Packaging Materials Product Manager, Andy C. Mackie, Ph.D. and Applications Engineer Jim Hisert.
Industry News | 2009-02-15 20:20:27.0
Indium Corporation's Senior Technical Support Engineer Mario Scalzo and Technical Support Engineer Ed Briggs had their papers accepted for presentation at the IPC/JEDEC Conference, Transitioning to Lead Free � Strategies for Implementation, in Santa Clara, California, March 3-5, 2009. Both Mario and Ed are based at Indium's global headquarters in Clinton, NY.
Industry News | 2015-10-30 15:33:26.0
Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.
Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Liwu Industrial Park, Yuanzhou Town, Boluo
Huizhou, 30 China
Phone: +86-138-29839112
.png)
