Industry News | 2003-07-03 08:59:23.0
Continues to expect second quarter 2003 revenues to meet or exceed analyst consensus revenues of $443 million and consensus earnings per share of $0.44.
Industry News | 2008-02-07 16:21:35.0
LIVERMORE, Calif.-Feb. 7, 2008-Adept Technology, Inc. (NASDAQ:ADEP) a leading provider of vision guided robotics today announced financial results for its fiscal 2008 second quarter, ended December 29, 2007.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2010-04-28 21:43:42.0
Following a successful evaluation period, DEK’s ProFlow® ATx enclosed print head technology has been adopted by a high profile electronics company due to its ability to meet complex mass production requirements. As specialists in design, production and product management, the electronics solutions company had strict evaluation criteria that the DEK system successfully met and even, in some cases, exceeded.
Industry News | 2008-03-20 13:22:56.0
Agilent Technologies Inc. (NYSE: A) today unveiled a limited access solution for In-Circuit Test (ICT) users that eliminates the need for physical test points, offering benefits that traditional VTEP test cannot provide.
Industry News | 2021-03-15 15:34:56.0
ASM Pacific Technology Limited ("ASMPT" / the "Group") (Stock code: 0522) announced its annual results for the year ended 31 December 2020. ASMPT's technologies enable its diverse range of customers to create a wide range of semiconductor and electronic products and services for the digitally-enabled world.
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