Industry News | 2016-11-22 17:37:02.0
The SMTA Capital Chapter is pleased to announce its final meeting of 2016 was a great success. Zentech graciously hosted the chapter meeting. The meeting had over 30 attendees representing various companies in the electronics industry including Northrop Grumman, L-3 Communications, Harris, DRS Technologies, BrainScope, and many others. Attendees enjoyed a fully catered dinner from La Prima. Mr. John Travis of Nordson YESTECH gave an excellent presentation on “AXI and MXI; How They Complement Each Other”. After the presentation, attendees participated in a facility tour and Mr. Travis gave a full demonstration of the Nordson YESTECH X3 AXI (Automated X-Ray Inspection) system.
Industry News | 2016-09-29 20:30:17.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on September 26 at IPC's Fall Standards Development Committee Meetings in Rosemont, Ill. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.
Industry News | 2019-04-23 08:08:27.0
Saki Corporation announces the release of its new 2Di-LU1 inline bottom-side automated optical inspection (AOI) system at NEPCON China, Shanghai, China, and SMTconnect, Nuremberg, Germany. Saki's 2D line-scan technology is ultra-fast, capturing the image of an entire 460x500mm printed circuit board assembly (PCBA) and carriers of 610x610mm in one pass, in real time, storing the image into memory, and creating inspection data for the entire board.
Industry News | 2019-08-28 00:00:21.0
Saki Corporation will exhibit its 2Di-LU1 2D bottom-side automated optical inspection (AOI) system at NEPCON Asia along with its 3D AOI and solder paste inspection (SPI) systems and M2M capabilities for ensuring defect-free electronics for automotive and mobile applications. To demonstrate the speed and effectiveness of its 2D bottom-side AOI, Saki is collaborating with Ersa, Wertheim, Germany, to inspect the bottom-side of a printed circuit board assembly (PCBA) after Ersa's SMARTFLOW 2020 selective soldering process.
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