Industry News: laboratory equipments (Page 34 of 43)

Toddco General, Inc. TG-1000 Hot Bar Bonding System for large displays and substrates

Industry News | 2014-08-16 17:55:06.0

Toddco General, Inc. released the new TG-1000 bonding platform to easily support large display panels or other substrates requiring hot bar bonding of flexible circuits, TABs, COF or COG. Designed for process development labs, high-mix production or repair environments.

Toddco3

Datest Signs Representative Agreement with DiversiTech Representatives

Industry News | 2015-05-19 19:27:46.0

Datest today announced that it has appointed DiversiTech Representatives, Inc. as its sales representative. DiversiTech will represent Datest’s advanced, efficient and mission-critical in-circuit testing, test engineering, failure analysis and X-ray inspection solutions throughout Southern California and Northern Baja California.

Datest

Akrometrix LLC to Demonstrate Real-Time Analysis, Array Generation (wafer partitioning), and 2D/3D Interface Analysis Software at productronica, U.S. Pavilion Hall A3, Booth 112/1

Industry News | 2015-10-22 16:56:59.0

Akrometrix LLC will exhibit in Hall A3, Booth 112/1 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Company representatives will exhibit Akrometric’s TherMoire’ AXP modular metrology platform which provides shadow moire’, digital fringe projection, and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

Indium Corporation’s Insight on Solder Preforms to Reduce Voiding in Bottom Termination Components

Industry News | 2015-10-30 15:33:26.0

Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.

Indium Corporation

Rework, Inspect, Solder and Reflow with Ersa at SMTAI

Industry News | 2016-08-29 18:40:48.0

Kurtz Ersa North America is pleased to announce that it will exhibit in Booth #1034 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Ersa’s team will demonstrate the HR 550 Rework system, Ersa Mobile Scope, i-CON VARIO 4 and Smartflow 2020.

kurtz ersa Corporation

Graco AFD Introduces UniXact Precision Automated Dispense Solutions

Industry News | 2016-09-29 10:34:15.0

Graco Advanced Fluid Dispense (AFD), a world leader in fluid handling products and systems, announces the availability of Graco UniXact, a fully automated precision dispense solution that combines Graco dispense expertise with Cartesian XYZ motion. UniXact dispense solutions includes technologies proven for mass production and ability to support large scale operations. It offers a single source for motion, fluid dispense, and process monitoring that provides process security and lowers the risk of product defects due to human error. Graco’s proprietary motion software makes fully automated dispensing easier than ever.

Graco, Inc.

Saline Lectronics purchases Nikon Metrology X-ray System

Industry News | 2017-01-15 19:31:24.0

Saline Lectronics today announced that it has purchased and installed a Nikon Metrology XT V 160 Varian 1313Dx X.Tract PCB inspection system with the Advanced Service Kit, AutoTransformer, and Inspect-X Software. This new system will better enable Lectronics to provide customers with fast, automated 3D component inspection.

Saline Lectronics, Inc

STI Electronics Selected for a Best Paper Award for BTC/QFN Test Board Design Research

Industry News | 2017-01-17 15:39:40.0

STI Electronics today announced that it has been selected to receive the “Best of Conference” award for a paper presented during SMTA International in September. The paper entitled “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes” was co-authored by Dr. Mike Bixenman of KYZEN, and Mark McMeen and Jason Tynes from STI Electronics.

STI Electronics

Datest Appoints Circuit Technology, Inc. as its Representative in the Carolinas

Industry News | 2018-01-31 07:51:45.0

Datest today announced that it has appointed Circuit Technology, Inc. (CTI) as its representative throughout North and South Carolina.

Datest

KYZEN receives 2019 NPI Award for AQUANOX A4727 next-generation Aqueous Assembly Cleaner at 2019 IPC APEX EXPO

Industry News | 2019-01-30 20:34:24.0

KYZEN was awarded a 2019 NPI Award in the category of Cleaning Materials for its brand new AQUANOX A4727. The award was presented to Tom Forsythe, Executive VP, during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. KYZEN has been recognized with more than 60 industry awards, largely for its AQUANOX line.

KYZEN Corporation


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