Industry News | 2010-01-19 18:34:34.0
Panasonic Factory Solutions
Industry News | 2012-07-11 08:10:50.0
Microscan, will demonstrate its latest products, designed to ensure process traceability and increase throughput in clinical applications, in the company’s booth #2537 at the AACC’s Clinical Lab Expo.
Industry News | 2019-01-30 20:34:24.0
KYZEN was awarded a 2019 NPI Award in the category of Cleaning Materials for its brand new AQUANOX A4727. The award was presented to Tom Forsythe, Executive VP, during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. KYZEN has been recognized with more than 60 industry awards, largely for its AQUANOX line.
Industry News | 2021-10-31 04:57:58.0
Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.
Industry News | 2021-12-21 14:53:11.0
PVA today announced plans to exhibit at the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The team will showcase four systems in Booth #2301, including the Delta 8 Selective Conformal Coating Machine with the new Valve Tool Changer and 5th Axis Motorized Tilt. Additionally, a Delta 8 Coating/Dispensing System will be equipped with a PDP Progressive Cavity Dual Pump with Fiducial Camera and Needle Calibration, another Delta 8 Coating/Dispensing System will be on display with the MR1 Metered Piston Dispenser, and the Sigma Benchtop Robot will be shown with the FCS300 Spray Valve and FCM100 Front Closing Micro Dispense Valve.
Industry News | 2022-01-03 07:38:59.0
Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.
Industry News | 2013-11-04 14:24:00.0
When the 20th productronica opens its gates in Munich in a few days, it will feature a multifaceted supporting program. The CEO Roundtable will allow leading executives from the commercial and scientific sectors to discuss the topic "Industry 4.0 - Opportunities and Challenges for a Competitive Production of Tomorrow". Among other things, the event will focus on the international exchange of ideas and information within the electronics production sector.
Industry News | 2008-05-12 19:33:55.0
Based on its recent analysis of the printed circuit board (PCB) markets, Frost & Sullivan recognizes Endicott Interconnect Technologies, Inc. with the North American Frost & Sullivan Award for Growth Excellence of the Year. The Award lauds Endicott for demonstrating excellence in manufacturing, revenue growth; dedication to customer service, and a well executed sales and marketing strategy.
Industry News | 2012-08-24 17:15:44.0
STI Electronics, Inc announces the appointment of Cathy Cross as its outside sales representative for FL and the southern regions of AL and GA.
Industry News | 2017-11-29 14:28:56.0
Nordson MARCH announces its new-generation RollVIA™ plasma system, a completely self-contained vacuum plasma system with production-proven, roll-to-roll material handling for flexible printed circuit board (PCB) manufacturing. The new RollVIA incorporates unique vacuum and gas flow technology, new process control technology, updated electrode designs, and superior temperature management with precise control of roll speed, tension, and edge guidance for uniform plasma treatment of substrates as thin as 25 microns. The RollVIA system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during production of PCBs.
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