Industry News | 2002-04-04 07:43:27.0
The Companies Will Develop and Produce Substrate Materials for High-speed Applications
Industry News | 2011-02-24 21:39:40.0
The assembly of solar panels is very similar to the assembly of printed boards, making solar power a hot opportunity for electronics assemblers. A small but growing market, solar module production is projected to increase 273% from 2010 to 2014, according to iSuppli. Shedding some light on the rapidly advancing business of solar panel assembly, IPC will host the Solar Assembly and Solar Living Pavilion on the show floor at IPC APEX EXPO, April 12–14, 2011, in Las Vegas.
Industry News | 2017-05-15 15:41:33.0
IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Jhubei, Hsinchu County, Taiwan. TUC provides mass lamination services, copper clad laminates and prepregs to the global electronics industry. To earn the QPL, TUC successfully completed an intensive audit based on IPC's foremost standard on base materials for laminates and prepregs: IPC 4101, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Industry News | 2020-03-08 16:47:51.0
IPC's Validation Services Program has awarded and renewed an IPC-4101 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC). TUC is an electronics materials manufacturing company headquartered in Jhubei, Hsinchu County, Taiwan. TUC was the first manufacturer worldwide to gain QPL listing for copper-clad laminates and prepregs in February 2017. TUC successfully renewed and completed an intensive second audit based on IPC's foremost standard on base materials for laminates and prepregs: IPC 4101, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Industry News | 2015-08-20 13:42:15.0
IPC — Association Connecting Electronics Industries® has released IPC-4101D-WAM1, an amendment to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. This newly revised standard delivers trending information for base materials used for rigid and multilayer printed boards.
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2014-05-15 16:32:40.0
Ongoing IPC Initiative to Open Dialogue Between Electronics Manufacturers and Policymakers
Industry News | 2015-03-11 14:26:45.0
IPC’s global statistical programs for the laminate, solder, process consumables and assembly equipment industries are now open to new participants for 2015. The deadline for IPC members to sign up is April 15. Participation is free to IPC-member companies as a benefit of membership.
Industry News | 2022-09-26 06:21:56.0
IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Zhubei, Hsinchu County, Taiwan.
