Industry News | 2011-06-13 17:27:43.0
Christopher Associates Inc. will display an extensive range of new technologies in the North Hall, Stand 5706 at the upcoming Intersolar North America 2011, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco.
Industry News | 2012-02-07 00:27:29.0
SMART Group will host a four-part Webinar series titled Guide to Modern Multilayer Manufacture Webinar. Part 1 will take place from 14.30-16.00 GMT on Tuesday, March 6, 2012.
Industry News | 2012-06-11 22:12:24.0
Colonial Circuits has acquired an ESI 5200 Laser as an integral part of upgrading their facility to handle the highest technology products including Micro and Stacked vias.
Industry News | 2012-06-27 14:15:24.0
Mark Osborn, President and Owner of Colonial Circuits announced recently that his company has acquired and installed Chemcut’s SA2330D Developer and SA2320 Alkaline Etcher in their facility as part of their on-going initiative to upgrade their facility to handler HDI and Micro via technologies.
Industry News | 2012-11-02 19:39:20.0
Engineered Conductive Materials, announces that Rich Wells will present “Conductive Adhesives for Back Contact Solar Modules” during the upcoming MWT Workshop, scheduled to take place November 20-21, 2012 at the Nemo Center in Amsterdam, The Netherlands.
Industry News | 2012-11-27 15:42:35.0
Engineered Conductive Materials, LLC,, will present “Conductive Adhesives for Back Contact Solar Modules” during the upcoming China Solar Grade Silicon and PV Power Conference (CSPV), scheduled to take place December 6-8, 2012 at the Shanghai Nan Jiao Hotel in Shanghai, China.
Industry News | 2013-03-27 15:21:59.0
PNC Inc. is proud to announce its latest UL qualification of polyimide base materials. PNC has partnered with Ventec USA using VT-901 laminate and VT-901PP prepreg. These high-temperature, high-reliability products expand PNC’s wide product offering and introduces the manufacturer into new industries at a new competitive level. The qualification includes 0.002” inner layer cores and a minimum overall board thickness stack up of 0.025”. The qualification also includes a minimum outer layer copper thickness of half ounce copper while inner layer maximum is two ounce copper.
Industry News | 2013-04-04 15:35:32.0
Engineered Material Systems, Inc., introduces the DF-1014 Dry Film Negative Photoresist for use in Micro-Electro-Mechanical Systems (MEMS). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2013-04-17 15:55:55.0
Isola announced that it has enhanced its Quick Turnaround (QTA) Service in the US to support its customers’ Just-in-Time (JIT) inventory strategies and QTA programs.
Industry News | 2015-01-06 17:08:54.0
Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and IC cooling applications, is pleased to introduce the DF-3020 dry-film negative photo resist for use in micro electro mechanical systems (MEMS) and wafer-level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
