Industry News: laminant (Page 7 of 35)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2013-06-11 19:23:26.0

The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open.

Surface Mount Technology Association (SMTA)

Congresswoman Sinema Tours Isola Group

Industry News | 2014-01-08 18:09:35.0

Congresswoman Kyrsten Sinema (AZ-9) visited Isola's manufacturing and R&D facilities in Chandler, Arizona on Friday, January 3 to learn about the issues that concern the developer and manufacturer of materials used to fabricate advanced printed circuit boards.

Association Connecting Electronics Industries (IPC)

SIX INDUSTRY VOLUNTEERS RECEIVE IPC PRESIDENT’S AWARD Awards Presented for Contributions to IPC and the Electronics Industry

Industry News | 2014-04-08 16:54:42.0

In recognition of their significant contributions of time, talent and ongoing leadership in IPC and the electronics industry, six long-time IPC volunteers were presented with IPC President’s Awards at IPC APEX EXPO® at Mandalay Bay Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

Best Technical Paper at IPC APEX EXPO Selected

Industry News | 2015-02-15 17:55:40.0

The best technical conference paper of IPC APEX EXPO 2015 has been selected. Voted on through a ballot process by members of IPC’s Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 24.

Association Connecting Electronics Industries (IPC)

New IPC Report Details How PCB Manufacturers Meet Today’s Technology Demands

Industry News | 2015-06-01 11:53:34.0

PCB Technology Trends 2014, a global biennial study published this month by IPC – Association Connecting Electronics Industries®, is now available. The survey-based study shows how PCB manufacturers are meeting today’s technology demands and looks at the changes expected by 2019 that will affect PCB fabricators and their suppliers of materials and equipment.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Papers for Third Annual IPC High Reliability Forum

Industry News | 2018-08-29 19:35:22.0

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC High Reliability Forum to be held May 14–16, 2019 in Hanover (Baltimore), Md.

Association Connecting Electronics Industries (IPC)

IPC’s Annual High Reliability Forum Adds Microvia Summit to Conference Lineup Event to discuss solutions to microvia challenges and reliability concerns for Class 3 electronics

Industry News | 2019-03-25 19:02:23.0

IPC’s High Reliability Forum and Microvia Summit, a three-day technical conference to be held in Hanover, Md., May 14-16, will focus on electronics for mil-aero, automotive, and long-life applications.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for Electronics Materials Forum Presentations sought on emerging technologies

Industry News | 2019-04-14 18:51:44.0

IPC -- Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.

Association Connecting Electronics Industries (IPC)

Emerging Technologies Take Center Stage at IPC Electronics Materials Forum

Industry News | 2019-09-11 14:47:58.0

The IPC Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing for board fabrication, assembly and post-assembly protection. The three-day forum, to be held November 5-7 in Bloomington, Minn. will be co-located with a Pb-free Electronics Risk Management (PERM) Council meeting.

Association Connecting Electronics Industries (IPC)

IPC and High Density Package Users Group Sign MoU, Strengthening Collaboration and Value to Membership

Industry News | 2020-06-24 15:45:07.0

IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.

Association Connecting Electronics Industries (IPC)


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