Industry News: laminate material class 3 (Page 11 of 38)

ISOLA GROUP NAMES INDUSTRY VETERAN MICHAEL WHITE AS CHIEF REVENUE OFFICER

Industry News | 2017-07-17 18:38:40.0

Isola Group has named industry veteran Michael White to the newly created position of Chief Revenue Officer.

Isola Group

Isola Expands Commercial Production of I-Speed(R) PCB Materials Into Asia

Industry News | 2013-12-18 15:18:53.0

Isola Group had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products. The cost benefits of manufacturing in Asia have enabled a price reduction of I-Speed for printed circuit board (PCB) fabricators located in the Asia-Pacific region.

Isola Group

SMART Group Launches Modern Manufacture Webinar Series

Industry News | 2012-02-07 00:27:29.0

SMART Group will host a four-part Webinar series titled Guide to Modern Multilayer Manufacture Webinar. Part 1 will take place from 14.30-16.00 GMT on Tuesday, March 6, 2012.

The SMART Group

3M Electronic Solutions Division Introduces Halogen-Free Embedded Capacitance Material

Industry News | 2010-04-12 15:30:49.0

IPC APEX Expo Conference and Exhibition, Las Vegas – Design engineers in the electronics industry who are seeking ways to improve power integrity and reduce electromagnetic interference (EMI) while meeting halogen-free requirements now have a new solution to meet their needs. The 3M Electronic Solutions Division now offers halogen-free* versions of its Embedded Capacitance Material (ECM).

3M Electronics Materials Solutions Division

Engineered Material Systems to Debut Low-Cost Conductive Adhesive for Back Contact Solar Modules at SNEC 2013

Industry News | 2013-04-25 16:35:51.0

Engineered Material Systems will debut its new DB-1588-2 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in booth #W3-688 at the 2013 SNEC 7th International Photovoltaic Power Generation Conference & Exhibition, scheduled to take place May 14-16, 2013 at the Shanghai New International Expo Center in China.

Engineered Materials Systems, Inc.

Engineered Materials Systems Debuts DF-2000 Series Dry Film Negative Photoresist at IWLPC

Industry News | 2013-10-04 16:50:46.0

Engineered Material Systems Inc will showcase its DF-2000 Series Dry Film Negative Photoresists in booth #14 at the International Wafer Level Packaging Conference (IWLPC), scheduled to take place November 6-7, 2013 at the Doubletree Hotel in San Jose, Calif.

Engineered Materials Systems, Inc.

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Industry News | 2018-05-08 19:23:28.0

Engineered Material Systems announces plans to exhibit at the SNEC PV Power Expo, scheduled to take place May 28-30, 2018 in Shanghai, China. The company will showcase its CA-150 Series snap cure, low-cost conductive adhesive for stringing and shingling crystalline silicon and heterojunction solar modules in Hall W3, Booth 806.

Engineered Materials Systems, Inc.

Engineered Material Systems to Showcase CA-150 Series Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Industry News | 2017-03-14 10:58:12.0

Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules. The new conductive adhesive will be displayed in Hall W3, booths 806/807 at the SNEC PV Power Expo, scheduled to take place April 19-21, 2017 in Shanghai, China.

Engineered Materials Systems, Inc.

Isola Announces Conversion Service in the Wake of Global Shortages of RF Substrates

Industry News | 2014-07-21 15:43:47.0

Isola Group announced that its technical staff would offer a conversion service for PCB fabricators of radio frequency (RF) and millimeter-wave applications. This global 24-hour design review service will enable PCB fabricators to quickly and cost-effectively transition their current RF substrates to Isola's RF products and eliminate the production backlogs caused by the current shortages of RF substrates.

Isola Group

Practical Components Adds Test Board for 0.3 mm Pitch Dummy CVBGA Test Vehicle

Industry News | 2012-01-17 11:05:35.0

Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.

Practical Components, Inc.


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